Thermal- and solution-processable polyimides based on mellophanic dianhydride and their applications as heat-resistant adhesives for copper-clad laminates

Reactive and Functional Polymers

Volumn 71, Issue 2, 2011, Pages 109-120

  Hasegawa, Masatoshi ^a   Nomura, Ryo ^a  

^a TOHO UNIVERSITY   (Japan)

Author keywords

Copper clad laminate; Heat resistant adhesive; Mellophanic dianhydride; Solution processable polyimide; Thermo processable polyimide

Indexed keywords

COPPER FOILS; COPPER-CLAD LAMINATES; ELONGATION AT BREAK; FILM PROPERTIES; FILM TOUGHNESS; HEAT-RESISTANT ADHESIVE; HIGH-ADHESION; HIGH-T; HIGH-TEMPERATURE ADHESIVES; LOW PROCESSING TEMPERATURE; MELLOPHANIC DIANHYDRIDE; PI SYSTEMS; PROCESSABILITY; PROCESSABLE; PYROMELLITIC DIANHYDRIDE; THERMO-OXIDATIVE STABILITY;

COPPER; LAMINATES; NEMATIC LIQUID CRYSTALS; PROCESSING; WATER ABSORPTION;

POLYIMIDES;

EID: 78650110528     PISSN: 13815148     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.reactfunctpolym.2010.11.021     Document Type: Article

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