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Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 15, Issue 3, 1997, Pages 1446-1450

High-selectivity pattern transfer processes for self-assembled monolayer electron beam resists

(6) Carr, D W a Lercel, M J a Whelan, C S a Craighead, H G a Seshadri, K b Allara, D L b

a Cornell University ^* (United States)

b PENNSYLVANIA STATE UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BI-LAYER; ELECTROLESS DEPOSITION; ELECTRON BEAM RESIST; ETCH MASK; INTERMEDIATE LAYERS; NATIVE OXIDES; NICKEL LAYERS; NOVEL PROCESS; PATTERN TRANSFER PROCESS; POLY-CRYSTALLINE SILICON; REACTIVE ION ETCH; RESIST LAYERS; SAMS; SELECTIVE DEPOSITION; SELECTIVE REMOVAL; SUBSTRATE MODIFICATIONS; ULTRA-THIN;

CYCLOTRONS; ELECTROLESS PLATING; ELECTRON BEAMS; NICKEL PLATING; POLYSILICON; SILICON COMPOUNDS; SILICON OXIDES;

SELF ASSEMBLED MONOLAYERS;

EID: 78649958759 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.580559 Document Type: Article

Times cited : (41)

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