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Volumn , Issue , 2000, Pages 472-475

Plasma doping system for 200 and 300mm wafers

Author keywords

[No Author keywords available]

Indexed keywords

300 MM WAFERS; ANODE CATHODES; CATHODIC PULSE; CLUSTER TOOL; CONTAMINATION CONTROL; DISPLACEMENT CURRENTS; DOSE CONTROL; END STATIONS; FIRST ORDER; INTEGRATION PROCESS; MASS FLOW CONTROLLER; N-TYPE DOPANTS; NOVEL METHODS; OPERATIONAL PERFORMANCE; PLASMA DOPING; PLASMA FORMATIONS; PLASMA IGNITION; PLASMA PROCESSING; PRESSURE REGULATION SYSTEMS; PROCESS CHAMBERS; PROCESS PRESSURE; PULSE CHARGE; WAFER HANDLING SYSTEMS;

EID: 78649837847     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/.2000.924190     Document Type: Conference Paper
Times cited : (28)

References (8)
  • 1
    • 78649831299 scopus 로고
    • Ion Implantation Technology - 92, D. Downey, M. Farley, K. Jones, G. Ryding, Eds. Amsterdam: Elsevier
    • J. Freeman, "Ion beams in prospect," in Ion Implantation Technology - 92, D. Downey, M. Farley, K. Jones, G. Ryding, Eds. Amsterdam: Elsevier, 1993, pp. 357-368.
    • (1993) Ion Beams in Prospect , pp. 357-368
    • Freeman, J.1
  • 2
    • 0001495430 scopus 로고
    • Plasma immersion ion implantation for ULSI Processing
    • N. Cheung, "Plasma immersion ion implantation for ULSI Processing, " Nucl. Instr. Meth. vol. B55, pp. 811-820, 1991
    • (1991) Nucl. Instr. Meth. , vol.B55 , pp. 811-820
    • Cheung, N.1
  • 3
    • 0031546169 scopus 로고    scopus 로고
    • Plasma doping optimization for ultra-shallow junctions
    • E. Jones and N. Cheung, "Plasma doping optimization for ultra-shallow junctions", Nucl. Instr. Meth. vol. B121, pp. 216-220, 1997
    • (1997) Nucl. Instr. Meth. , vol.B121 , pp. 216-220
    • Jones, E.1    Cheung, N.2
  • 4
    • 78649831301 scopus 로고    scopus 로고
    • US Patent #5354381
    • T. Sheng, US Patent #5354381.
    • Sheng, T.1
  • 6
    • 0030374648 scopus 로고    scopus 로고
    • Ion Implantation Technology - 96. E. Ishida, S. Banerjee, S. Mehta, T. Smith, M. Current, L. Larson, A. Tasch, Eds. IEEE
    • M. Sieradzki "Manufacturing Advantages of Single Wafer High Current Ion Implantation," Ion Implantation Technology - 96. E. Ishida, S. Banerjee, S. Mehta, T. Smith, M. Current, L. Larson, A. Tasch, Eds. IEEE, 1997, pp.519-522.
    • (1997) Manufacturing Advantages of Single Wafer High Current Ion Implantation , pp. 519-522
    • Sieradzki, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.