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Volumn , Issue , 2000, Pages 472-475
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Plasma doping system for 200 and 300mm wafers
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Author keywords
[No Author keywords available]
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Indexed keywords
300 MM WAFERS;
ANODE CATHODES;
CATHODIC PULSE;
CLUSTER TOOL;
CONTAMINATION CONTROL;
DISPLACEMENT CURRENTS;
DOSE CONTROL;
END STATIONS;
FIRST ORDER;
INTEGRATION PROCESS;
MASS FLOW CONTROLLER;
N-TYPE DOPANTS;
NOVEL METHODS;
OPERATIONAL PERFORMANCE;
PLASMA DOPING;
PLASMA FORMATIONS;
PLASMA IGNITION;
PLASMA PROCESSING;
PRESSURE REGULATION SYSTEMS;
PROCESS CHAMBERS;
PROCESS PRESSURE;
PULSE CHARGE;
WAFER HANDLING SYSTEMS;
CLUSTER COMPUTING;
ION IMPLANTATION;
PLASMA DEVICES;
PLASMAS;
SEMICONDUCTOR DEVICE MANUFACTURE;
SEMICONDUCTOR DOPING;
PROCESS CONTROL;
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EID: 78649837847
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/.2000.924190 Document Type: Conference Paper |
Times cited : (28)
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References (8)
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