Influence of ultrasonication on the mechanical properties of Cu/Al2O3 nanocomposite thin films during electrocodeposition

Surface and Coatings Technology

Volumn 205, Issue 7, 2010, Pages 2362-2368

  Kim, Minho ^a   Sun, Fangfang ^a   Lee, Jaebeom ^a   Hyun, Yang Ki ^b   Lee, Dongyun ^a  

^a Pusan National University   (South Korea)

^b Korea Institute of Material Science   (South Korea)

Author keywords

Electrocodeposition; Grain refinement; Nanocomposites; Thin films; Ultrasonication

Indexed keywords

CU FILMS; CU THIN FILM; ELECTROCODEPOSITION; GRAIN SIZE; HIGH SURFACE ENERGY; MATRIX; NANOCOMPOSITE FILM; NANOCOMPOSITE THIN FILMS; NANOINDENTATION TESTS; TENSILE TESTS; ULTIMATE TENSILE STRESS; ULTRA-SONICATION; ULTRASONIC ENERGY;

AGGLOMERATION; COPPER; DENSITY (SPECIFIC GRAVITY); GRAIN REFINEMENT; GRAIN SIZE AND SHAPE; NANOCOMPOSITES; NANOINDENTATION; NANOPARTICLES; STRESSES; SURFACE CHEMISTRY; TENSILE TESTING; THIN FILMS; VAPOR DEPOSITION; YIELD STRESS;

MECHANICAL PROPERTIES;

EID: 78649749328     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.09.049     Document Type: Article

References (26)

1. Lee D., Gan Y.X., Chen X., Kysar J.W. Mater. Sci. Eng., A 2007, 447:209.
2. Stojak J.L., Fransaer J., Talbot J.B. Weinheim. Advances in Electrochemical Science and Engineering 2002, Vol. 7:193. Wiley-VCH. R.C. Alkire, D.M. Kolb (Eds.).
3. Barkey D.P., Muller R.H., Tobias C.W. J. Electrochem. Soc. 1989, 136:2207.
4. Yang Z.N., Zhang Z., Zhang J.Q. Surf. Coat. Technol. 2006, 200:4810.
5. Molares M., Buschmann V., Dobrev D., Neumann R., Scholz R., Schuchert I.U., Vetter J. Adv. Mater. 2001, 13:62.
6. Gao T., Meng G.W., Zhang J., Wang Y.W., Ling C.H., Fan J.C., Zhang L.D. Appl. Phys. A 2001, 73:251.
7. Tian M., Wang J., Kurtz J., Mallouk T.E., Chan M.H.W. Nano Lett. 2003, 3:919.
8. Liu J., Duan J.L., Toimil-Molres M.E., Karim S., Cornelius T.W., Dobrev D., Yao H.J., Sun Y.M., Hou M.D., Mo D., Wang Z.G., Neumann R. Nanotechnology 2006, 17:1922.
9. Pan H., Liu B., Yi J., Poh C., Lim S., Ding J., Feng Y., Huan C.H.A., Lin J. J. Phys. Chem. B 2005, 109:3094.
10. Saedi A., Ghorbani M. Mater. Chem. Phys. 2005, 91:417.
11. Low C.T.J., Wills R.G.A., Walsh F.C. Surf. Coat. Technol. 2006, 201:371.
12. Schlesinger M., Paunovic M. Modern Electroplating 2000, JohnWiley & Sons, Inc., (Chapter 1).
13. Qu N.S., Chan K.C., Zhu D. Scr. Mater. 2004, 50:1131.
14. Shen Y.F., Xue W.Y., Wang Y.D., Liu Z.Y., Zuo L. Surf. Coat. Technol. 2008, 202:5140.
15. Shrestha Nabeen K., Sakurada Kazuaki, Masuko Masabumi, Saji Tetsuo Surf. Coat. Technol. 2001, 140:175.
16. Garcia I., Fransaer J., Celis J.-P. Surf. Coat. Technol. 2001, 148:171.
17. Gan Y., Lee D., Chen X., Kysar J.W. J. Eng. Mater. Technol. Trans. ASME 2005, 127:451.
18. Pharr G.M., Oliver W.C. MRS Bull. 1992, 17:28.
19. Ogawa J. Statisical Theory of the Analysis of Experimental Designs 1974, Marcel Dekker, New York.
20. Gan Y.X., Wei C., Lam M., Wei X., Lee D., Kysar J.W., Chen X. J. Mater. Sci. 2007, 42:5256.
21. Zimmerman A.F., Clark D.G., Aust K.T., Erb U. Mater. Lett. 2002, 52:85.
22. Zhang Y., Peng X., Wang F. Mater. Lett. 2004, 58:1134.
23. Li J., Sun Y., Sun X., Qiao J. Surf. Coat. Technol. 2005, 192:331.
24. Benea L., Bonora P.-L., Borello A., Martelli S. Wear 2002, 249:995.
25. Shao I., Vereecken P.M., Chien C.L., Searson P.C., Cammarata R.C. J. Mater. Res. 2002, 17:1412.
26. Hu F., Chan K.C. Trans. Inst. Met. Finish. 2006, 84:252.