Structure and properties of electrocodeposited Cu-Al2O 3 nanocomposite thin films

Journal of Engineering Materials and Technology

Volumn 127, Issue 4, 2005, Pages 451-456

  Gan, Yong ^a   Lee, Dongyun ^a   Chen, Xi ^a   Kysar, Jeffrey W ^a  

^a Columbia University ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERING; COMPOSITE MATERIALS; COPPER COMPOUNDS; CRYSTALLOGRAPHY; ELECTRONS; INDENTATION; MICROELECTROMECHANICAL DEVICES; MORPHOLOGY; NANOSTRUCTURED MATERIALS; SILICON WAFERS;

COPPER METAL MATRIX; CRYSTALLOGRAPHIC TEXTURE; NANOCOMPOSITE THIN FILMS; VOLUME DENSITY;

THIN FILMS;

EID: 27744604678     PISSN: 00944289     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1925292     Document Type: Article

References (45)

1. Hardwick, D. A., 1987, "Mechanical Properties of Thin Films - A Review," Thin Solid Films, 154, pp. 109-124.
2. Vinci, R. P., and Vlassak, J. J., 1996, "Mechanical Behavior of Thin Films," Annu. Rev. Mater. Sci., 26, pp. 431-462.
3. Oliver, W. C., and Pharr, G. M., 2004, "Measurement of Hardness and Elastic Modulus by Instrumented Indentation: Advances in Understanding and Refinements to Methodology," J. Mater. Res., 19, pp. 3-20.
4. Srikar, V. T., and Spearing, S. M., 2003, "A Critical Review of Microscale Mechanical Testing Methods Used in the Design of Microelectromechanical Systems," Exp. Mech., 43, pp. 238-247.
5. Yang, N. Y. C., Headley, T. J., Kelly, J. J., and Hruby, J. M., 2004, "Metallurgy of High Strength Ni-Mn Microsystems Fabricated by Electrodeposition," Scr. Mater., 51, pp. 761-766.
6. Malone, G. A., 1987, "New Developments in Electroformed Nickel-based Structural Alloys," Plat. Surf. Finish., 74, pp. 50-56.
7. Bouyaghroumni, A., Versaud, P., and Vittori, O., 1996, "Electrodeposition of Co-Ni on Aluminum Plate from Chloride Bath," Can. Metall. Q., 35, pp. 245-253.
8. Atanassov, N., and Schils, H. W., 1999, "Influence of Structural Parameters on the Properties of Electrolytic Ni-Mn-S Deposits," J. Appl. Electrochem.. 29, pp. 51-57.
9. Lu, L., Shen, Y. F., Chen, X. H., Qian, L. H., and Lu, K., 2004, "Ultrahigh Strength and High Electrical Conductivity in Copper," Science, 304, pp. 422-426.
10. Zhang, S., Sun, D., Fu, Y. Q., and Du, H. J., 2003, "Recent Advances of Superhard Nanocomposite Coatings: A Review," Surf. Coat. Technol., 167, pp. 113-119.
11. Stojak, J. L., Fransaer, J., and Talbot, J. B., 2002, "Review of Electrocodeposition," Advances in Electrochemical Science and Engineering, edited by R. C. Alkire and D. M. Kolb, Weinheim, Wiley-VCH, Vol. 7, pp. 193-223.
12. 3 Composite Coatings," Mater. Chem. Phys., 86, pp. 5-10.
13. Gyftou, P., Stroumbouli, M., Pavlatou, E. A., and Spyrellis, N., 2002, "Electrodeposition of Ni/SiC Composites by Pulse Electrolysis," Trans. Inst. Met. Finish., 80, pp. 88-91.
14. Podlaha, E. J., 2001, "Selective Electrodeposition of Nanoparticulates into Metal Matrices," Nano Lett., 1, pp. 413-416.
15. Kruger, H. G., Knote, A., Schindler, U., Kern, H., and Boccaccini, A. R., 2004, "Composite Ceramic-metal Coatings by Means of Combined Electrophoretic Deposition and Galvanic Methods," J. Mater. Sci., 39, pp. 839-844.
16. Burzynska, L., Rudnik, E., Blaz, L., Kotula, M., Sierpinski, Z., and Szymanski, W., 2003, "The Influence of Current Density and Bath Composition on the Electrodeposition of Nickel and Nickel/silicon Carbide Composite," Trans. Inst. Met. Finish., 81, pp. 193-198.
17. 3 Whiskers Nickel Composite Coating," Scr. Mater., 50, pp. 1131-1134.
18. Boccaccini, A. R., and Zhitomirsky, I., 2002, "Application of Electrophoretic and Electrolytic Deposition Techniques in Ceramics Processing," Curr. Opin. Solid State Mater. Sci., 6, pp. 251-260.
19. Teruyama, S., Shrestha, N. K., Ito, Y., Iwanaga, M., and Saji, T., 2004, "Plating of Ni/C-BN Composite Film in Two Steps," J. Mater. Sci., 39, pp. 2941-2943.
20. 3 Nanocomposites," J. Mater. Sci., 39, pp. 4063-4066.
21. Chan, K. C., Wang, C. L., Zhang, K. F., and Pang, G., 2004, "Superplastic Deformation Behavior of the Electrocodeposited Ni/SiC Composite," Scr. Mater., 51, pp. 605-609.
22. 3 Dispersions," Appl. Surf. Sci., 227, pp. 383-386.
23. 3 Composite Coatings Bearing Nanoparticles," J. Mater. Res., 18, pp. 1566-1574.
24. Palumbo, G., Gonzalez, F., Tomantschger, K., Erb, U., and Aust, K. T., 2003, "Nanotechnology Opportunities for Electroplating Industries." Plat. Surf. Finish., 90, pp. 36-45.
25. Zimmerman, A. F., Palumbo, G., Aust, K. T., and Erb, U., 2002, "Mechanical Properties of Nickel Silicon Carbide Nanocomposites," Mater. Sci. Eng., A, 328, pp. 137-146.
26. 2 Electroplated Coatings," Surf. Coat. Technol., 140, pp. 147-154.
27. 3 Particles on Microstructure and Cracking-Resistance of NiO Scale on Electrodeposited Nickel Films," Mater. Sci. Eng., A, 298, pp. 100-109.
28. Kim, S. K., and Yoo, H. J., 1998, "Formation of Bilayer Ni-SiC Composite Coatings by Electrodeposition," Surf. Coat. Technol., 108, pp. 264-569.
29. Cheng, D. H., Xu, W. Y., Hua, L. Q., Zhang, Z. Y., and Wan, X. J., 1998, "Electrochemical Preparation & Mechanical Properties of Amorphous Nickel-SiC Composites," Plat. Surf. Finish., 85, pp. 61-64.
30. Malone, G. A., 1991, "Electrodeposition of Dispersion-strengthened Alloys," Plat. Surf. Finish., 78, pp. 58-62.
31. Muller, R., Schmid, P., Munding, A., Gronmaier, R., and Kohn, E., 2003, "Elements for Surface Microfluidics in Diamond," Diamond Relat. Mater., 13, pp. 780-784.
32. Rebeiz, G. M., 2003, RF MEMS: Theory, Design and Technology, Wiley, Hoboken.
33. Zhao, Y. P., and Wang, L. S., 2003, "Mechanics of Adhesion in MEMS - A Review," J. Adhes. Sci. Technol., 17, pp. 519-546.
34. Stojak, J. L., and Talbot, J. B., 1999, "Investigation of Electrodeposition Using a Rotating Cylinder Electrode," J. Electrochem. Soc., 146, pp. 4504-4513.
35. 3 Composite Coatings," Mater. Chem. Phys., 86, pp. 5-10.
36. Hu, F., and Chan, K. C., 2004, "Electrodeposition Behavior of Ni-SiC Composite under Different Shaped Waveform," Appl. Surf. Sci., 233, pp. 163-171.
37. Barkleit, G., Grahl, A., Maccagni, M., Olper, M., Scharf, P., and Wagner, R., 1999, "Electrodeposited, Dispersion-Hardened, Lightweight Grids for Lead-Acid Batteries," J. Power Sources, 78, pp. 73-78.
38. Bon, P., Zhitomirsky, I., and Embury, J. D., 2004, " Electrodeposition of Composite Iron Oxide-Polyelectrolyte Films," Mater. Chem. Phys., 86, pp. 44-50.
39. Eng, Y., 1991, "Electrocodeposition of Metal and Colloidal Particle Composite Films onto a Rotating Cylinder Electrode," Ph.D. thesis, Columbia University.
40. Lowenheim, A. F., 1978, Electroplating, McGraw-Hill, New York.
41. Budevski, E., Staikov, G., and Lorenz, W. J., 1996, Electrochemical Phase Formation and Growth: An Introduction to the Initial Stages of Metal Deposition, VCH Publishers, New York.
42. Chen, X., and Vlassak, J. J., 2001, "A Numerical Study on the Measurement of Thin Film Mechanical Properties By Means of Nanoindentation, " J. Mater. Res., 16, pp. 2974-2982.
43. Oliver, W. C., and Pharr, G. M., 1992, "An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments," J. Mater. Res., 7, pp. 1564-1583.
44. Ogawa, J., 1974, Statistical Theory of the Analysis of Experimental Designs, Marcel Dekker, New York.
45. Senturia, S. D., 2001, Microsystem Design, Kluwer Academic, Boston.