Investigation of the substrate activation mechanism and electroless Ni-P coating ductility and adhesion

Microelectronic Engineering

Volumn 69, Issue 2-4, 2003, Pages 391-398

  Khoperia, T N ^a  

^a ANDRONIKASHVILI INSTITUTE OF PHYSICS   (Georgia)

Author keywords

Activation; Ductility; Electroless deposition; Microelectronics; Resistless technology; Sensitization

Indexed keywords

ADHESION; DIELECTRIC MATERIALS; DUCTILITY; MICROELECTRONICS; PHASE TRANSITIONS; RADIOISOTOPES; TOXIC MATERIALS;

ALLOY STRUCTURES;

ELECTROLESS PLATING;

EID: 0141456735     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00326-5     Document Type: Conference Paper

References (19)

1. Khoperia T.N. Electroless nickel plating of non-metallic materials. Gorbunova K.M. Monograph. 1982;144 Metallurgia, Moscow. in Russian.
2. Khoperia T.N. Electroless plating method with Ni-P alloy instead of gilding and silvering. Proceedings of the 10th World Congress of Metal Finishing (Interfinish'80), Kyoto:1980;147-151.
3. Khoperia T.N., Tabatadze T.J., Zedginidze T.I. Formation of microcircuits in microelectronics by electroless deposition. Electrochim. Acta. 42:1997;3049-3055.
4. Gorbunova K.M., Nikiforova A.A., Sadakov G.A., Moiseev V.P., Ivanov M.V. Physical-chemical bases of the process of electroless cobalt plating. 1974;219 Nauka, Moscow. in Russian.
5. Ohno I., Haruyama S. Surf. Technol. 13:1981;1.
6. Ting C.H., Paunovic M., Pai P.L., Chiu G. J. Electrochem. Soc. 136:1989;456-462.
7. Mallory G.O., Hajdu J.B. Electroless Plating: Fundamentals and Applications. 1990;AESFS, Orlando, FL.
8. Sambucetti C.J., O'Sullivan E., Romankiw L.T. Abstracts. 40th International Society of Electrochemistry Meeting, Kyoto:1989.
9. Osaka T., Homma T. Interface. 4:1995;42.
10. Lopatin S., Shacham-Diamand Y., Dubin V.M., Vasudev P.K., Zhao B., Pellerin J. Paunovic M., Scherson D.A. Electrochemically deposited thin films. Proceedings. Vol. 19:1997;271 Electrochemical Society, Pennington, NJ.
11. Kobayashi T., Ishibashi J., Mononobe S., Ohtsu M., Honma H. J. Electrochem. Soc. 147:2000;1046.
12. Schlesinger M., Paunovic M. Modern Electroplating. 4th Edition:2000;Wiley, New York.
13. Khoperia T.N. Electroless metallization of non-metallic materials and ductility of Ni-P coatings. Proceedings of the International Conference Micro Materials, Berlin:2000;771-787.
14. Khoperia T.N. Investigation of the mechanism and kinetics of activation for electroless plating and competitive submicron and LIGA technologies. Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling, PV 99-33. The Electrochemical Society Proceedings Series. 2000;251-262 Electrochemical Society, Pennington, NJ.
15. Khoperia T.N. Investigation of metal film adhesion to dielectrics and production of 3-D microdevices by electroless deposition. Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling, PV 99-33. Electrochemical Society Proceedings Series. 2000;147-155 Electrochemical Society, Pennington, NJ.
16. Khoperia T.N. Electroless deposition of Ni-P alloy in electronics. Thin Film Transistor Technologies, PV 2000-31. Electrochemical Society Proceedings Series. 2001;182-197 Electrochemical Society, Pennington, NJ.
17. Khoperia T.N. Physical and chemical bases of substitution of gold and silver coatings by non-noble metals and new technology for micro- and submicron miniaturization. Georgian Academy of Sciences, Chemistry and Chemical Technology, Proceedings. 2001;210-233 Metsniereba, Tbilisi. in Russian.
18. Sviridov V.V., Vorobiova T.N., Gaevskaya T.V., Stepanova L.I. Electroless Metal Deposition in Aqueous Solutions. 1987;270 Byelorussian University, Minsk. in Russian.
19. Mende G., Fenske F., Flienter H., Jeske M., Schultze J.W. Electrochim. Acta. 39:(No. 8/0):1994;1259-1264.