Electroless copper plating system of potassium sodium tartrate and EDTA·2Na

Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology)

Volumn 36, Issue 6, 2005, Pages 971-976

  Zheng, Ya Jie ^a   Zou, Wei Hong ^a   Yi, Dan Qing ^a   Gong, Zhu Qing ^a   Li, Xin Hai ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

ABS substrate; Deposition rate; Electroless copper plating; Stability

Indexed keywords

EID: 31844447342     PISSN: 16727207     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)