Preparation and characterization of high-temperature silver thick film and its application in multilayer chip inductances

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 372, Issue 1-3, 2010, Pages 120-126

  Wu, S P ^a   Zheng, L Q ^a   Zhao, Q Y ^a   Ding, X H ^b  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd   (China)

Author keywords

Electrical properties; Electronic materials; Microstructure; Silver thick films; Surfaces

Indexed keywords

ELECTRIC RESISTANCE; FILM PREPARATION; INDUCTANCE; MATERIALS PROPERTIES; MECHANICAL PROPERTIES; MICROSTRUCTURE; MULTILAYERS; SINTERING; SURFACE ACTIVE AGENTS; SURFACE TENSION; SURFACES; THICK FILMS; VAPOR DEPOSITION;

APPARENT VISCOSITY; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL PROPERTY; ELECTRONIC MATERIALS; HIGH TEMPERATURE; HIGH-ADHESION; LEAD-FREE; SILVER FILM; SILVER PASTES; SINTERING TEMPERATURES;

SILVER;

SILVER; SURFACTANT;

ADHESION; ARTICLE; ELECTRONICS; ELECTROPLATING INDUSTRY; FILM; HIGH TEMPERATURE; PRIORITY JOURNAL; SURFACE TENSION; TEMPERATURE; VISCOSITY;

EID: 78649442660     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2010.09.038     Document Type: Article

References (13)

1. Rane S.B., Seth T., Phatak G.J., Amalnerkar D.P., Das B.K. Influence of surfactants treatment on silver powder and its thick films. Mater. Lett. 2003, 57:3096-3100.
2. Umarji G.G., Ketkar S.A., Phatak G.J., Giramkar V.D., Mulik U.P., Amalnerkar D.P. An aqueous developable photoimageable silver conductor composition for high density electronic packaging. Microelectron. Reliabil. 2005, 45:1903-1909.
3. Rane S.B., Khanna P.K., Seth T., Phatak G.J., Amalnerkar D.P., Das B.K. Firing and processing effects on microstructure of fritted silver thick film electrode materials for solar cells. Mater. Chem. Phys. 2003, 82:237-245.
4. 2 glasses. J. Non-Cryst. Solids. 2006, 352:821-826.
5. Seo D.S., Park S.H., Lee J.K. Sinterability and conductivity of silver paste with Pb-free frit. Curr. Appl. Phys. 2009, 9:S72-S74.
6. Park S.H., Seo D.S., Lee J.K. Preparation of Pb-free silver paste containing nanoparticles. Colloids Surf. A 2008, 313-314. 197-201.
7. Park K.J., Seo D.S., Lee J.K. Conductivity of silver paste prepared from nanoparticles. Colloids Surf. A. 2008, 313-314. 351-354.
8. Lin J.C., Wang C.Y. Effect of surface properties of silver powder on the sintering of its thick-film conductor. Mater. Chem. Phys. 1996, 45:253-261.
9. Wu S.P., Meng S.Y. Preparation of ultrafine silver powder using ascorbic acid as reducing agent and its application in MLCI. Mater. Chem. Phys. 2005, 89:423-427.
10. Wu S.P. Preparation of micron size flake silver powders for conductive thick films. J. Mater. Sci. Mater. Electron. 2007, 18:447-452.
11. Nguyen T.L.H., Roussel N., Cousso P. Correlation between L-box test and rheological parameters of a homogeneous yield stress fluid. Cement Concrete Res. 2006, 36:1789-1796.
12. Norton M.G. Glass-ceramic interactions and thick-film metallization of aluminium nitride J. Mater. Sci. 1991, 26:2322-2328.
13. Yajima K.I., Yamaguchi T. Sintering and microstructure development of glass-bonded silver thick films. J. Mater. Sci. 1984, 19:777-784.