An aqueous developable photoimageable silver conductor composition for high density electronic packaging

Microelectronics Reliability

Volumn 45, Issue 12, 2005, Pages 1903-1909

  Umarji, G G ^a   Ketkar, S A ^a   Phatak, G J ^a   Giramkar, V D ^a   Mulik, U P ^a   Amalnerkar, D P ^a  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

Author keywords

[No Author keywords available]

Indexed keywords

BOROSILICATE GLASS; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; EPOXY RESINS; SILVER; THICK FILMS;

PHOTOIMAGEABLE SILVER CONDUCTOR; SILVER POWDERS; THICK FILM CONDUCTOR PASTES;

ELECTRIC CONDUCTORS;

EID: 27744466955     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.03.007     Document Type: Conference Paper

References (7)

1. John H. Lau, and S.W. Ricky Lee Microvias 1st ed. 2001 McGraw Hill New York
2. Glicksman HD, Howard David, Yang, Haixin. Aqueous developable photoimageable thick film compositions with photospeed enhancer. Patent USA Application 20030138708, 24th July 2001.
3. Takeda T, Saegusa M. Photosensitive Ag pastes and optical imaging devices with fine electrode patterns manufactured therefrom. Japanese Patent JP 2001188342, 10th July 2001.
4. Umarji GG, Ketkar SA, Marimuthu R, Phatak GJ, Seth T, Amalnerkar DP. Photoimageable conductor composition for high density electronic packaging of smart devices and allied subsystems. In: Proc 15th National Symp on Smart and Light Mat, 2004, AGM MRSI, Banaras, India, p. 64.
5. S.B. Rane, M.S. Ghatpande, T. Seth, G.J. Phatak, and D.P. Amalnerkar Effects of surfactant on silver powder with respect to rheology and sintering of its thick film paste Transactions of the SAEST 37 3 and 4 2002 95 98
6. Muckett S, Minalgene J. Hybridas photoimageable thick film process and materials for microwave and sensor component applications. Private Communication 2004.
7. M.A. Skurski, M.A. Smith, R.R. Draudt, D.I. Amey, S.J. Horowitz, and M.J. Champ Photoimageable silver cofireable conductor compatible with 951 Green Tape Int J Microcirc Electron Packaging 21 4 1998 355 360