Characterization of microstructures for heat transfer performance in passive cooling devices

2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008

Volumn 2, Issue , 2009, Pages 789-798

  Ranjan, Ram ^a   Garimella, Suresh V ^a   Murthy, Jayathi V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE DISTANCE; BOND NUMBERS; CAPILLARY PRESSURES; CONDUCTION RESISTANCE; FREE LIQUID SURFACE; FREE SURFACES; GEOMETRICAL PARAMETERS; HEAT TRANSFER PERFORMANCE; HEXAGONAL PACKING; LIQUID VOLUME; PASSIVE COOLING; PERFORMANCE PARAMETERS; SOLID WALL; SURFACE AREA; SURFACE EVOLVER; THERMAL CONDUCTION; VERTICALLY ALIGNED; WICKING;

CONTACT ANGLE; COOLING; CYLINDERS (SHAPES); GEOMETRY; HEAT EXCHANGERS; HEAT TRANSFER; MICROSTRUCTURE; STRUCTURAL PANELS; THIN FILM DEVICES; TOPOLOGY;

LIQUIDS;

EID: 70349109278     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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