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Volumn 59, Issue 2, 2011, Pages 671-677
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Void growth in copper during high-temperature power-law creep
a
CENTRE SMS
(France)
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Author keywords
Creep test; Damage; Synchrotron tomography; Void growth
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Indexed keywords
CREEP TESTS;
DAMAGE;
DISLOCATION GLIDE;
FUNCTIONAL FORMS;
HIGH-TEMPERATURE POWER;
SUBMICROMETER RESOLUTION;
SYNCHROTRON TOMOGRAPHY;
VISCOUS MODELS;
VOID GROWTH;
VOID SHAPE;
CREEP;
GRAIN BOUNDARIES;
SYNCHROTRONS;
TOMOGRAPHY;
GRAIN GROWTH;
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EID: 78449261894
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2010.10.003 Document Type: Article |
Times cited : (35)
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References (38)
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