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Volumn 59, Issue 2, 2011, Pages 671-677

Void growth in copper during high-temperature power-law creep

Author keywords

Creep test; Damage; Synchrotron tomography; Void growth

Indexed keywords

CREEP TESTS; DAMAGE; DISLOCATION GLIDE; FUNCTIONAL FORMS; HIGH-TEMPERATURE POWER; SUBMICROMETER RESOLUTION; SYNCHROTRON TOMOGRAPHY; VISCOUS MODELS; VOID GROWTH; VOID SHAPE;

EID: 78449261894     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.10.003     Document Type: Article
Times cited : (35)

References (38)
  • 26
    • 78449233803 scopus 로고    scopus 로고
    • PhD thesis, Ruhr Universität Bochum
    • Dzieciol K. PhD thesis, Ruhr Universität Bochum; 2010.
    • (2010)
    • Dzieciol, K.1
  • 29
    • 77957237362 scopus 로고    scopus 로고
    • San-Francisco, 14-19 February
    • Dzieciol K, Isaac A, Sket F, Borbély A, Pyzalla AR. In: Proc EPD congress, San-Francisco, 14-19 February; 2009. p. 15.
    • (2009) Proc EPD Congress , pp. 15
    • Dzieciol, K.I.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.