Experimental study of molten solder removal from discarded printed circuit board by blowing-off method

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering

Volumn 46, Issue 19, 2010, Pages 192-198

  Pan, Xiaoyong ^a   Long, Danfeng ^b   Yang, Jiping ^c   Li, Zhongliang ^a   Zhi, Hui ^a  

^a Sichuan Changhong Electric Co Ltd   (China)

^b TSINGHUA UNIVERSITY   (China)

^c Logistical Engineering University of PLA   (China)

Author keywords

Blowing off; Disassembly Component; Discarded printed circuit board; Recycle

Indexed keywords

AUTOMATIC DISASSEMBLY; BLOWING ANGLE; BLOWING OFF; DISASSEMBLY COMPONENT; DISCARDED PRINTED CIRCUIT BOARDS; EXPERIMENTAL CONDITIONS; EXPERIMENTAL EQUIPMENTS; EXPERIMENTAL STUDIES; HOT AIR; MOLTEN SOLDERS; MOVING SPEED; ORTHOGONAL EXPERIMENT; PROCESS PARAMETERS; RECYCLE; REMOVAL RATE; TELEVISION SET; THROUGH HOLE;

OPTIMIZATION; PRINTED CIRCUIT MANUFACTURE; RECYCLING;

PRINTED CIRCUIT BOARDS;

EID: 78449233246     PISSN: 05776686     EISSN: None     Source Type: Journal    
DOI: 10.3901/JME.2010.19.192     Document Type: Article

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