Removal force models for component disassembly from waste printed circuit board

Resources, Conservation and Recycling

Volumn 53, Issue 8, 2009, Pages 448-454

  Yang, Jiping ^a,b   Xiang, Dong ^a   Wang, Jinsong ^a   Duan, Guanghong ^a   Zhang, Hong chao ^c  

^a TSINGHUA UNIVERSITY   (China)

^b ARMY ENGINEERING UNIVERSITY OF PLA   (China)

^c Department of Electrical and Computer Engineering   (United States)

Author keywords

Disassembly; Electronic component; Force analysis; PCB; Printed circuit board; Recycling

Indexed keywords

ANALYTICAL METHOD; BEND ANGLE; COMPONENT RECOVERY; DISASSEMBLY; ELECTRONIC COMPONENT; EXTERNAL FORCE; FORCE ANALYSIS; FORCE MODEL; IN-DEPTH STUDY; MATERIAL SEPARATION; PCB; QUALITATIVE ANALYSIS; QUANTITATIVE ANALYSIS; RECYCLING WASTES; SURFACE MOUNT DEVICE; THROUGH HOLE; WASTE PRINTED CIRCUIT BOARD;

ACCELERATION; AMPLIFIERS (ELECTRONIC); ELECTROMAGNETIC WAVE EMISSION; INDUSTRIAL APPLICATIONS; INTERNET PROTOCOLS; OSCILLATORS (ELECTRONIC); PRINTED CIRCUIT MANUFACTURE; RECYCLING; RESEARCH; WETTING;

PRINTED CIRCUIT BOARDS;

ELECTRONIC EQUIPMENT; FORCE; MODELING; RECYCLING; SOLID WASTE;

ACCELERATION; ANALYTIC METHOD; ARTICLE; MATHEMATICAL COMPUTING; QUALITATIVE ANALYSIS; QUANTITATIVE ANALYSIS; RECYCLING; WASTE;

EID: 67349260507     PISSN: 09213449     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.resconrec.2009.03.007     Document Type: Article

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