Cross-linked microchannels for vlsi hotspot cooling

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 13-17

  Jiang, Linan ^a   Koo, Jae Mo ^a   Wang, Evelyn ^a   Bari, Abdullahel ^a   Cho, Eun Seok ^c   Ong, Wendy ^a   Prasher, Ravi S ^b   Maveety, Jim ^b   Kim, Min Soo ^c   Kenny, Thomas W ^a   Santiago, Juan G ^a   Goodson, Kenneth E ^a  

^a Stanford University   (United States)

^b INTEL CORPORATION   (United States)

^c Seoul National University   (South Korea)

Author keywords

Electronic cooling; Microchannel heat sinks; Non uniform heating; Two phase flow

Indexed keywords

COOLING; ELECTROMECHANICAL DEVICES; HEAT FLUX; HEAT SINKS; HEATING; HYDRAULICS; LEAKAGE (FLUID); MECHANICAL ENGINEERING; MEMS; PRESSURE EFFECTS; TWO PHASE FLOW;

CAPILLARY EFFECTS; CHIP TEMPERATURE; ELECTRONIC COOLING; FUTURE GENERATIONS; HEAT DISSIPATION; HOT SPOT; HOTSPOTS; HYDRAULIC DIAMETER; LATERAL TRANSPORT; LOCALIZED HEATING; MICROCHANNEL HEAT SINKS; NONUNIFORM HEATING; PRESSURE DIFFERENCES; PRESSURE-DRIVEN; THERMAL MANAGEMENT; WATER FLOWS;

MICROCHANNELS;

EID: 78249279128     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-39238     Document Type: Conference Paper

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