Convective boiling in microchannel heat sinks with spatially-varying heat generation

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 341-346

  Koo, Jae Mo ^a   Jiang, Linan ^a   Bari, A ^a   Zhang, L ^a   Wang, E ^a   Kenny, T W ^a   Santiago, J G ^a   Goodson, K E ^a  

^a Stanford University   (United States)

Author keywords

Cooling; Heat engines; Heat sinks; Heat transfer; Hydraulic diameter; Microchannel; Temperature distribution; Thermal conductivity; Thermal resistance; Very large scale integration

Indexed keywords

COOLING; DROPS; FLOW OF FLUIDS; HEAT ENGINES; HEAT FLUX; HEAT GENERATION; HEAT PIPES; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; MICROCHANNELS; PRESSURE DROP; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; VLSI CIRCUITS;

ELECTROOSMOTIC PUMPS; HEAT PIPE TECHNOLOGY; HEAT TRANSFER AND FLUID FLOW; HYDRAULIC DIAMETER; MICRO CHANNEL HEAT SINKS; SATURATION TEMPERATURE; TEMPERATURE VARIATION; WALL-TEMPERATURE DISTRIBUTION;

TWO PHASE FLOW;

EID: 50949104558     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012477     Document Type: Conference Paper

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