Effect of heat treatment of carbon nanofibres on electroless copper deposition

Composites Science and Technology

Volumn 70, Issue 16, 2010, Pages 2269-2275

  Tamayo Ariztondo, J ^a   Cordoba J M ^b   Oden M ^b   Molina Aldareguia, J M ^c   Elizalde, M R ^a  

^a CEIT   (Spain)

^b LINKÖPING UNIVERSITY   (Sweden)

^c IMDEA MATERIALS INSTITUTE   (Spain)

Author keywords

A. Copper; A. Metal matrix composites; A. Nanofibres; E. Heat treatment

Indexed keywords

A. COPPER; A. METAL MATRIX COMPOSITES; A. NANOFIBRES; CARBON NANOFIBRES; CARBON STRUCTURES; COEFFICIENT OF THERMAL EXPANSION; COPPER COATINGS; E. HEAT TREATMENT; ELECTROCHEMICAL DEPOSITION; ELECTROLESS COPPER DEPOSITION; ELECTROLESS DEPOSITION; FIBRE SURFACES; GRAPHENE PLANE; HEAT SINK MATERIALS; HIGH THERMAL CONDUCTIVITY; LOW CTE; MATRIX; PROCESSING METHOD;

CARBON NANOFIBERS; COATINGS; COPPER; ELECTROLESS PLATING; GRAPHENE; HEAT SINKS; HEAT TREATMENT; PLATELETS; REDUCTION; THERMAL EXPANSION;

METALLIC MATRIX COMPOSITES;

EID: 78249251112     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2010.07.015     Document Type: Article

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