Growth and characterization of electroless deposited Cu films on carbon nanofibers

Surface and Coatings Technology

Volumn 203, Issue 22, 2009, Pages 3459-3464

  Cordoba J M ^a   Oden M ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

Author keywords

Carbon nanofibers; Deposition; Electroless; Film

Indexed keywords

CHEMICAL COMPOSITIONS; COPPER FILMS; CU FILMS; ELECTROLESS; ELECTROLESS DEPOSITION; ENERGY DISPERSIVE X RAY SPECTROSCOPY; GLASSY CARBON; HIGH QUALITY; OPTIMIZED PROCESS; PRE-TREATMENT; ROOM TEMPERATURE; SCANNING ELECTRONS;

CARBON FILMS; COPPER; COPPER DEPOSITS; GRAPHITE; METALLIC FILMS; MICROSTRUCTURE; RARE EARTHS; SCANNING ELECTRON MICROSCOPY; SORPTION; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY;

CARBON NANOFIBERS;

EID: 67649414920     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.05.007     Document Type: Article

References (28)

1. Xing H., Sun L., Song G., Gou J., and Hao Y.W. Nanotechnology 19 (2008)
2. Lozano K., Bonilla-Rios J., and Barrera E.V. J. Appl. Polym. Sci. 80 (2001) 1162
3. Vandenbrande P., and Winand R. Surf. Coat. Technol. 52 (1992) 1
4. Mortimer D.A., and Nicholas M. J. Mater. Sci. 5 (1970) 149
5. Neubauer E., Korb G., Eisenmenger-Sittner C., Bangert H., Chotikaprakhan S., Dietzel D., Mansanares A.M., and Bein B.K. Thin Solid Films 433 (2003) 160
6. Arai S., and Endo M. Electrochem. Commun. 5 (2003) 797
7. Schrank C., Eisenmenger-Sittner C., Neubauer E., Bangert H., and Bergauer A. Thin Solid Films 459 (2004) 276
8. Ma J., Park C., Rodriguez N.M., and Baker R.T.K. J. Phys. Chem., B 105 (2001) 11994
9. Lu W., Donepudi V.S., Prakash J., Liu J., and Amine K. Electrochim. Acta 47 (2002) 1601
10. O. Mallory, J. B. Hajdu, Electroless plating. Fundamentals and Applications, ed. Noyes Publications/William Andrew Publishing, LLC, New York, 1990, Chapter 12 pp. 289-389.
11. Johnson B., Amster R., and Vanasupa L. J. Electron. Mater. 27 (1998) 923
12. Nguyen T., Charneski L.J., and Evans D.R. J. Electrochem. Soc. 144 (1997) 3634
13. Yung E.K., Romankiw L.T., and Alkire R.C. J. Electrochem. Soc. 136 (1989) 206
14. Lakshminarayanan P.V., Toghiani H., and Pittman C.U. Carbon 42 (2004) 2433
15. Hur K.H., Jeong J.H., and Lee D.N. J. Mater. Sci. 25 (1990) 2573
16. Murakami Y., Hisaeda Y., Ozaki T., and Matsuda Y. J. Chem. Soc., Chem. Commun. (1989) 1094
17. Córdoba J.M., Aritzondo J.T., Aldareguia J.M.M., Elizalde M.R., and Odén M. Corr. Sci. 51 (2009) 926
18. Ebbesen T.W., Hiura H., Bisher M.E., Treacy M.M.J., ShreeveKeyer J.L., and Haushalter R.C. Adv. Mater. 8 (1996) 155
19. Gómez de Salazar J.M., Barrena M.I., Merino C., and Merino N. Mater. Lett. 62 3 (2007) 494
20. Xu C.L., Wu G.W., Liu Z., Wu D.H., Meek T.T., and Han Q.Y. Mater. Res. Bull. 39 (2004) 1499
21. Scherrer P. Nachr. Ges. Wiss. Gött. 2 (1918) 96
22. Zumdhal S.S., and Zhumdal S.A. Chemistry. sixth ed. (2003), Houghton Mifflin Company, Boston
23. Donnet J.B., Schultz J., and Shanahan M.E.R. Int. Symp. on Carbon Toyohashi, Japan (1982) 57
24. Nardin M., Balard H., and Papirer E. Carbon 28 (1990) 43
25. Papirer E., Li S., Balard H., and Jagiello J. Carbon 29 (1991) 1135
26. Papirer E., Brendle E., Ozil F., and Balard H. Carbon 37 (1999) 1265
27. Feng Y., and Yuan H.L. J. Mater. Sci. 39 (2004) 3241
28. Chen X.H., Xia J.T., Peng J.C., Li W.Z., and Xie S.S. Compos. Sci. Technol. 60 (2000) 301