Closed loop impingement cooling system for high power density electronic devices

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 7, Issue , 2002, Pages 157-163

  Bhunia, Avijit ^a   Chen, Chung Lung ^a  

^a ROCKWELL SCIENTIFIC COMPANY   (United States)

Author keywords

Closed loop system; Electronic device cooling; Liquid impingement; Phase change

Indexed keywords

CLOSED LOOP SYSTEMS; COOLING; CURRENT VOLTAGE CHARACTERISTICS; DIODES; HEAT SINKS; LIQUID FILMS; MECHANICAL ENGINEERING; ORIFICES; SEMICONDUCTING SILICON COMPOUNDS; SILICON CARBIDE; THERMOELECTRIC EQUIPMENT; WATER INJECTION;

BASE PLATES; CLOSED LOOPS; DIODE CURRENTS; DROPLET IMPINGEMENT; ELECTRONIC DEVICE; ELECTRONIC DEVICE COOLING; HIGH-POWER DENSITY ELECTRONICS; IMPINGEMENT COOLING; INJECTION PATTERNS; INJECTION PORTS; LIQUID FLOW RATES; LIQUID JETS; MAXIMUM PHASE; PHASE CHANGE; PRACTICAL IMPLEMENTATION; RECOVERY SCHEME; SILICON CARBIDE DIODE; THIN LIQUID FILM;

ELECTRON DEVICES;

EID: 78249240885     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-33729     Document Type: Conference Paper

References (16)

1. Morse, A. W., Esker, P. M., Clarke, R. C., Brandt, C. D., Siergiej, R. R., and Agarwal, A. K., 1996, "Application of High Power Silicon Carbide Transistors at Radar Frequencies", WE3A-3, IEEE MTT-S Digest.
2. Ma, C. -F., and Bergles, A. E., 1986, "Jet Impingement Nucleate Boiling", Int. J. Heat Mass Trans., v 29, n 8, pp. 1095-1101.
3. Lay, J. H., and Dhir, V. K., 1995, "Nucleate Boiling Heat Flux Enhancement on Macro/Micro-structured Surfaces Cooled by an Impinging Jet", J. Enhanced Heat Transfer, v 2, pp. 177-188.
4. Wolf, D. H., Incropera, F. P., and Viskanta, R., 1996, "Local Jet Impingement Boiling Heat Transfer", Int. J. heat Mass Trans., v 39, n 7, pp. 1395-1406.
5. Zhang, L., Wang, E. N., Koch, J. D., Liu, J. T. C., Koo, J., Jiang, L., Goodson, K. E., Santiago, J. G., and Kenny, T. W., 2001, "Microscale Liquid Impingement Cooling", IMECE2001/MEMS-23820, ASME Intl. Mech. Eng. Cong. & Ex., New York, NY.
6. Pederson, C. O., 1970, "An Experimental study of the Dynamic Behavior and Heat Transfer Characteristics of Water Droplets Impinging upon a Heated Surface", Int. J. Heat Mass Trans., v 13, pp. 369-381.
7. rd Natl. Heat Trans. Conf., Albuquerque, NM.
8. Harvie, D. J. E., and Fletcher, D. F., 2001, "A Hydrodynamic and Thermodynamic Simulation of Droplet Impacts on Hot Surfaces, Part I & II", Int. J. Heat Mass Trans., v 44, pp. 2633-2659.
9. Kandlikar, S. G., 2001, "A Photographic Insight into the Motion of Liquid-vapor Interface during Rapid Evaporation of a Liquid Droplet on a Heated Surface", IMECE2001/HTD-24213, ASME Intl. Mech. Eng. Cong. & Ex., New York, NY.
10. Sawyer, M. L., Jeter, S. M., and Abdel-Khalik, S. I., 1997, "A Critical Heat Flux Correlation for Droplet Impact Cooling", Intl. J. Heat Mass Trans., v 40, n 9, pp. 2123-2131.
11. th AIAA Aerospace Sciences Meeting & Exhibit, Reno, NV.
12. Rini, D. P., Chen, R.-H., and Chow, L. C., 2002, "Bubble Behavior and Nucleate Boiling Heat Transfer in Saturated FC-72 Spray Cooling", J. Heat Trans., v 124, n 1, pp. 63-72.
13. Yao, S. C., Amon, C., Gabriel, K., Kumta, P., Murthy, J. Y., Wu, C. F., Hsieh, C. C., Boyalakuntla, D., Narumanchi, S. V. J., and Rebello, K., 2001, "MEMS enabled Micro Spray Cooling system for Thermal Control of Electronic Chips", IMECE2001/HTD-24392, ASME Intl. Mech. Eng. Cong. & Ex., New York, NY.
14. Mudawar, I., 2000, "Assessment of High-heat-flux Thermal management Schemes", IEEE Intersociety Conference on Thermal Phenomena, pp. 1-20.
15. Marcos, A., Chow, L. C., Du, J. -H., Lei, S., Rini, D. P., and Lindauer, J. J., 2002, "Spray Cooling at Low System Pressure", Proc. 18th Ann. IEEE Semiconductor Thermal Measurement & Management Symp., San Jose, CA, pp. 169-175. (Pubitemid 34269352)
16. Lefebvre, A. H., 1989, "Atomization and Sprays", Taylor & Francis.