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Volumn , Issue , 2002, Pages

Liquid impingement cooling of high power density silicon carbide semiconductor devices

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE ENGINEERING; COOLING; DROP BREAKUP; PIEZOELECTRIC TRANSDUCERS; PLATES (STRUCTURAL COMPONENTS); SEMICONDUCTING SILICON; SEMICONDUCTOR DIODES; SILICON CARBIDE; TRANSDUCERS; WIDE BAND GAP SEMICONDUCTORS;

EID: 85087599459     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2514/6.2002-209     Document Type: Conference Paper
Times cited : (4)

References (22)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.