TiAlCN/VCN nanolayer coatings suitable for machining of Al and Ti alloys deposited by combined high power impulse magnetron sputtering/unbalanced magnetron sputtering

Surface Engineering

Volumn 26, Issue 8, 2010, Pages 610-614

  Hovsepian, P E ^a   Ehiasarian, A P ^a   Petrov, I ^b  

^a SHEFFIELD HALLAM UNIVERSITY   (United Kingdom)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Al and Ti cutting; High power impulse magnetron sputtering; Nanolayers

Indexed keywords

AL AND TI CUTTING; BILAYER THICKNESS; BUILT-UP LAYERS; CARBON FORMS; CEMENTED CARBIDES; COATING ADHESION; DIAMOND LIKE CARBON; DRY MILLING; END MILL; HIGH POWER IMPULSE MAGNETRON SPUTTERING; HIGH-POWER; LAYER BY LAYER; NANO LAYERS; NANOLAYER COATING; NANOMETRES; NANOSCALE MULTILAYERS; ORTHOPAEDIC IMPLANTS; STATE OF THE ART; TI ALLOYS; TRIBOFILMS; UNBALANCED MAGNETRON SPUTTERING; WEAR MECHANISMS;

ALLOYS; ALUMINUM; CARBIDES; COATINGS; ELECTRON ENERGY LOSS SPECTROSCOPY; ENERGY DISSIPATION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MAGNETRON SPUTTERING; NANOSTRUCTURED MATERIALS; PHASE INTERFACES; SHEAR STRENGTH; TRIBOLOGY;

TITANIUM ALLOYS;

EID: 78149463005     PISSN: 02670844     EISSN: 17432944     Source Type: Journal    
DOI: 10.1179/026708408X336337     Document Type: Article

References (18)

1. M. Lahres, P. Mü ller-Hummel and O. Doerfel: Surf. Coat. Technol., 1997, 91, 116.
2. P. E. Hovsepian, Q. Luo, G. Robinson, M. Pittman, M. Howarth, D. Doerwald, R. Tietema, W. M. Sim, A. Deeming and T. Zeus: Surf. Coat. Technol., 2006, 201, 265.
3. S. Barnett and A. Madan: Phys. World, 1998, 11, 45.
4. Q. Luo, W. M. Rainforth and W.-D. Münz: Wear, 1999, 74, 225.
5. H. Holleck and V. Schier: Surf. Coat. Technol., 1995, 76-77, 328.
6. P. E. Hovsepian, Y. N. Kok, A. P. Ehiasarian, R. Haasch, J.-G. Wen and I. Petrov: Surf. Coat. Technol., 2005, 200, 1572.
7. P. E. Hovsepian, A. P. Ehiasarian, A. Deeming and C. Schimpf: Plasma Process. Polym., 2007, 4, S897.
8. P. E. Hovsepian, A. P. Ehiasarian and T. Deeming: PVD coated substrate, Pat. Appl. no. B0508485?0, 27 April 2005.
9. C. P. Constable, J. Yarwood, P. E. Hovsepian, L. A. Donohue, D. B. Lewis and W.-D. Mü nz: J. Vac. Sci. Technol. A, 2000, 18A, (4), 1681.
10. A. P. Ehiasarian, P. E. Hovsepian and W.-D. Münz: US patent no. 10718435, 2005.
11. A. P. Ehiasarian, Y. A. Gonsalvo and T. D. Whitmore: Plasma Process. Polym., 2007, 4, S309.
12. A. P. Ehiasarian, R. New, W.-D. Münz, L. Hultman, U. Helmersson and V. Kouznetsov: Vacuum, 2002, 65, (2), 147.
13. A. P. Ehiasarian, J. G.Wen and I. Petrov: J. Appl. Phys., 2007, 101, 054301.
14. D. Dineka, V. Suendo, P. Roca and I. Cabarrocas: Thin Solid Films, 2004, 468, 298.
15. O. O. Ajayi and K. C. Ludema: Wear, 1990, 140, 191.
16. Q. Luo and P. E. Hovsepian: Thin Solid Films, 2006, 497, 203.
17. P. E. Hovsepian, D. B. Lewis and W.-D. Mü nz: Surf. Coat. Technol., 2000, 133-134, 166.
18. Q. Luo, C. Schimpf, A. P. Ehiasarian and P. E. Hovsepian: Plasma Process. Polym., 2007, 4, S916.