Plasma activation and self bonding of peek for the use in the encapsulation of medical implants

Plasma Processes and Polymers

Volumn 7, Issue 9-10, 2010, Pages 866-875

  Awaja, Firas ^a   Zhang, Shengnan ^b   James, Natalie ^c   McKenzie, David R ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

^b UNIVERSITY OF SYDNEY   (Australia)

^c NONE   (United States)

Author keywords

medical implants; PEEK; plasma treatments; self bonding; X ray photoelectron spectroscopy (XPS)

Indexed keywords

BOND FORMATION; BOND STRENGTH; CANDIDATE MATERIALS; CENTRAL COMPOSITE ROTATABLE DESIGN; DIFFICULT MATERIAL; MEDICAL IMPLANTS; OXYGEN CONCENTRATIONS; PEEK; PLASMA ACTIVATION; PLASMA SURFACE MODIFICATIONS; PLASMA TREATMENTS; SELF BONDING; SEM; SURFACE ACTIVATION; SURFACE ENERGIES; SURFACE OXYGEN; THERMODYNAMIC INFORMATION; TOTAL SURFACE ENERGY; X-RAY PHOTOELECTRONS; XPS;

ADHESION; ANGLE MEASUREMENT; BOND STRENGTH (MATERIALS); CONTACT ANGLE; ELECTRONS; ENCAPSULATION; ETHERS; INTERFACIAL ENERGY; KETONES; OXYGEN; PHOTOELECTRICITY; PHOTONS; PLASMAS; SCANNING ELECTRON MICROSCOPY; SURFACE CHEMISTRY; SURFACE TREATMENT; TITANIUM; TITANIUM ALLOYS; X RAYS;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 78149457423     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.201000018     Document Type: Article

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