Modeling diffusion-control in the cure kinetics of epoxy-amine thermoset resins: An approach based on configurational entropy

Polymer

Volumn 51, Issue 24, 2010, Pages 5833-5845

  Corezzi, Silvia ^a   Fioretto, Daniele ^a   Santucci, Giovanni ^a   Kenny, Josè M ^a  

^a UNIVERSITY OF PERUGIA   (Italy)

Author keywords

Diffusion control; Epoxy; Kinetics

Indexed keywords

ACTIVATION ENERGY; CHEMICAL BONDS; CURING; ENTROPY; ENZYME KINETICS; KINETICS; POLYMERIZATION; RATE CONSTANTS; RELAXATION TIME; RESINS; STRUCTURAL DYNAMICS;

CHEMICAL RATE CONSTANTS; CONFIGURATIONAL ENTROPY; COVALENT BOND FORMATION; DIFFUSION CONTROL; EPOXY; POLYMERIZATION PROCESS; POWER LAW RELATIONSHIP; THERMALLY ACTIVATED BEHAVIOR;

DIFFUSION;

EID: 78149410457     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2010.09.073     Document Type: Article

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