Relation between mobility factor and diffusion factor for thermoset cure

Thermochimica Acta

Volumn 437, Issue 1-2, 2005, Pages 179-189

  Meng, Yan ^a   Simon, Sindee L ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

Diffusion factor; Mobility factor; Modulated DSC; Physical aging; Thermoset cure; TMDSC

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; EPOXY RESINS; ESTERS; REACTION KINETICS; THERMAL EFFECTS; THERMOSETS;

DIFFUSION FACTORS; MOBILITY FACTORS; MODULATED DIFFERENTIAL SCANNING CALORIMETRY (DSC); TEMPERATURE-MODULATED DIFFERENTIAL SCANNING CALORIMETRY (TMDSC); THERMOSET CURE;

CARRIER MOBILITY;

EID: 24944578284     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2005.06.032     Document Type: Article

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