Analysis of the effects of cold expansion of holes using thermoelasticity and image correlation

Fatigue and Fracture of Engineering Materials and Structures

Volumn 33, Issue 12, 2010, Pages 859-870

  Backman, D ^a   Cowal, C ^a   Patterson, E A ^b  

^a NATIONAL RESEARCH COUNCIL CANADA   (Canada)

^b Michigan State University   (United States)

Author keywords

cold expansion; crack growth; digital image correlation; fatigue; thermoelastic stress analysis

Indexed keywords

COLD EXPANSION; CRACK GROWTH; DIGITAL IMAGE CORRELATION; FATIGUE; THERMOELASTIC STRESS ANALYSIS;

CRACK PROPAGATION; CRACK TIPS; EXPANSION; FATIGUE OF MATERIALS; IMAGE ANALYSIS; MONITORING; STRAIN MEASUREMENT; STRESS ANALYSIS; TENSILE STRESS; THERMOELASTICITY;

STRAIN;

EID: 78049439128     PISSN: 8756758X     EISSN: 14602695     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2010.01472.x     Document Type: Article

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