Development of high strength, high conductivity copper by friction stir processing

Materials and Design

Volumn 32, Issue 2, 2011, Pages 911-916

  Surekha, K ^a   Els Botes, A ^a  

^a NELSON MANDELA METROPOLITAN UNIVERSITY   (South Africa)

Author keywords

[No Author keywords available]

Indexed keywords

BASE METALS; ELECTRICAL RESISTIVITY MEASUREMENTS; FINE GRAINS; FRICTION STIR; FRICTION STIR PROCESSING; GRAIN SIZE; HALL PETCH RELATIONSHIP; HEAT INPUT; HIGH CONDUCTIVITY; HIGH STRENGTH; PURE COPPER; ROOM TEMPERATURE; ROTATION SPEED; TRAVEL SPEED; TRAVERSE SPEED; ULTIMATE TENSILE STRENGTH; YIELD STRENGTH;

COPPER; ELECTRIC CONDUCTIVITY; FRICTION; GRAIN SIZE AND SHAPE; SPEED; TRIBOLOGY; YIELD STRESS;

TENSILE STRENGTH;

EID: 77958497194     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2010.08.028     Document Type: Article

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