Surface strengthening pure copper by Ni-B coating

Applied Surface Science

Volumn 221, Issue 1-4, 2004, Pages 62-68

  Ziyuan, Shi ^a   Deqing, Wang ^a   Zhimin, Ding ^a  

^a DALIAN JIAOTONG UNIVERSITY   (China)

Author keywords

Coating bath; Electroless deposition; Ni B coating; Pure copper

Indexed keywords

COMPOSITION; COPPER; ELECTRIC RESISTANCE; ELECTROLESS PLATING; HEAT TREATMENT; MICROHARDNESS; MICROSCOPES; MICROSTRUCTURE; PROTECTIVE COATINGS; SOLID SOLUTIONS; STRUCTURE (COMPOSITION); SURFACE PROPERTIES; SURFACES; VICKERS HARDNESS TESTING;

PHASE STRUCTURE; SPECIFIC RESISTANCE;

SURFACE PHENOMENA;

EID: 0344740827     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(03)00753-0     Document Type: Article

References (8)

1. Ziyuan S., Deqing W. J. Mater. Sci. Lett. 17(6):1998;477.
2. Bhat D.G., Rebenne H.E., Strandberg C. J. Mater. Sci. 26(7):1991;4567.
3. Feldslein M.D. Plating Surf. Finishing. 85(3):1998;248.
4. Himbeault D.D., Varin R.A., Piekarski K. Metall. Trans. A. 19A(8):1988;2109.
5. Abraham S., Pai B.C., Satyanarayana K.G., Vaidyan V.K. J. Mater. Sci. 25(8):1990;2839.
6. Kazimierzak B. Mater. Des. 13(2):1992;67.
7. Fromont R.I. Mater. Process. Rep. 7(2):1992;2.
8. Kupp E.R., Drawl W.R., Spear K.E. Surf. Coat. Technol. 68:1994;378.