Effects of addition of nano-scale alumina and silica fillers on thermal conductivity and dielectric strength of epoxy / alumina microcomposites

Proceedings of the 2010 IEEE International Conference on Solid Dielectrics, ICSD 2010

Volumn , Issue , 2010, Pages

  Okazaki, Yuta ^a   Kozako, Masahiro ^a   Hikita, Masayuki ^a   Tanaka, Toshikatsu ^b  

^a KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

Alumina filler; Component; epoxy nano composites; Dielectric strength; Metal base printed wiring board; Silica filler; Thermal conductivity

Indexed keywords

ALUMINA FILLERS; ALUMINA PARTICLES; AVERAGE PARTICLE SIZE; BASE MATERIAL; DIELECTRIC STRENGTHS; ELECTRICAL INSULATION PROPERTIES; ELECTRODE SYSTEMS; INSULATING LIQUIDS; LASER FLASH METHODS; METAL-BASE PRINTED WIRING BOARD; MICRO-COMPOSITES; MICRO-FILLERS; MICRO-SCALES; NANO SCALE; NANO/MICRO COMPOSITES; SCANNING ELECTRON MICROSCOPE; SILICA FILLER; SPHERICAL SHAPE;

DIELECTRIC MATERIALS; ELECTRIC PROPERTIES; NANOCOMPOSITES; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SILICA; SPHERES; THERMAL CONDUCTIVITY; THERMAL INSULATION; THERMOANALYSIS;

FILLERS;

EID: 77958047191     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSD.2010.5568057     Document Type: Conference Paper

References (15)

1. S. Konzelmann, C. Hoffmann, R. Merte and D. Peier, "Thermal and Electrical Properties of Aluminum Nitride Filled Epoxy-resin Compound", IEEE Trans. Dielectr. Electr. Insul., Vol.15, No.2, pp.327-333, 2008.
2. S. Singha and M. J. Thomas, "Dielectric Properties of Epoxy Nanocomposites", IEEE Trans. Dielectr. Electr. Insul., Vol. 15, No. 1, pp.12-23, 2008.
3. S. Singha and M. J. Thomas, "Influence of Filler Loading on Dielectric Properties of Epoxy-ZnO Nanocomposites", IEEE Trans. Dielectr. Electr. Insul., Vol. 16, No. 2, pp.531-542, 2009.
4. T. Tanaka, G. C. Montanari and R. Muelhaupt, "Polymer Nanocomposites ad Dielectrics and Electrical Insulation -Perspectives for Processing Technologies, MAterial Characterization and Future Applications-", IEEE Trans. Dielectr. Electr. Insul., Vol. 11, No. 5, pp.763-784, 2004.
5. T. Tanaka, "Dielectric Nanocomposites with Insulating Properties", IEEE Trans. Dielectr. Electr. Insul., Vol. 12, No. 3, pp.914-928, 2005.
6. M. Kozako, N. Fuse, Y. Ohki, T. Okamoto, and T. Tanaka, "Surface Degradation of Polyamide Nanocomposites Caused by Partial Discharges Using IEC (b) Electrodes", IEEE Trans. Dielectr. Electr. Insul., Vol. 11, No. 5, pp. 833-839, 2004.
7. M. Kozako, Y. Ohki, M. Kohtoh, S. Okabe, and T. Tanaka, "Preparation and Various Characteristics of Epoxy/ Alumina Nanocomposites", IEEJ Trans. A, Vol. 126, No. 11, pp.1121-1127, 2006.
8. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, "Influence of Temperature on Mechanical and Insulation Properties of Epoxy-Layered Silicates Nanocomposite", IEEE Trans. Dielectr. Electr. Insul., Vo. 13, No. 2, pp. 445-452, 2006.
9. T. Imai, F. Sawa, T. Ozaki, T. Shimizu, S. Kuge, M. Kozako and T. Tanaka, "Effects of Epoxy/Filler Interface on Properties of Nano- or Micro-composites", IEEJ Trans. A, Vol. 126, No. 2, pp.84-91, 2006.
10. T. Tanaka, Y. Ohki, M. Ochi, M. Harada and T. Imai, "Enhanced Partial Discharge Resistance of Epoxy/Clay Nanocomposite Prepared by Newly Developed Organic Modification and Solubilization Methods", IEEE Trans. Dielectr. Electr. Insul., Vol. 15, No. 1, pp.81-89, 2008.
11. Z. Li, K. Okamoto, Y. Ohki and T. Tanaka, "Role of Nano-fillers on Partial Discharge Resistance and Dielectric Breakdown Strength of Micro-A12O3 / Epoxy Composites", Proc. ICPADM, No.H-6, pp. 753-756, 2009.
12. J. K. Nelson and Y. Hu, "The Impact of Nanocomposite Formulations on Electrical Voltage Endurance", Proc. IEEE-ICSD, No. 7-10, pp.832-835, 2004.
13. M. Roy, J. K. Nelson, R. K. MAccrone, L. S. Schandler, C.W. Reed, R. Keefe and W. Zenger: "Polymer Nanocomposite Dielectrics- The Role of the interface", IEEE Trans. Dielect. Elect. Insul., Vol. 12, No. 4, pp. 629-643, 2005.
14. A. M. Travelpiece, J. K. Nelson, L. S. Schadler, and D. Schweickart, "Dielectric Integrity of High-Temperature Nanocomposites", 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomenon, No. 7A-07, pp. 571-574, 2008.
15. D. A. G Bruggeman, "Berechnung verschiedener physikalisher Konstanten von heterogenen Substanzen", Annalen der Physik, 24, pp. 636-664, 1935.