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Volumn , Issue , 2010, Pages 278-283

Alternative mould insert fabrication technology for micromoulding by galvanic replication

Author keywords

[No Author keywords available]

Indexed keywords

ECONOMICAL PRODUCTION; ELECTRICAL DISCHARGE MACHINING; EXPOSURE AREAS; FABRICATION TECHNOLOGIES; FORMING PROCESS; HIGH ASPECT RATIO; HOT-EMBOSSING; INJECTION MOULDING; INTERNATIONAL PARTNERS; JOINING TECHNOLOGY; LASER MANUFACTURING; LASER TECHNOLOGIES; MANUFACTURING CHAIN; MANUFACTURING METHODS; MASS PRODUCTION; MATERIAL COMBINATION; MECHANICAL MANUFACTURING; MICRO AND NANOSTRUCTURES; MICRO-COMPONENTS; MICROINTERFEROMETERS; MICROMOULDING; MICROSTRUCTURE TECHNOLOGY; MULTI MATERIALS; MULTISCALES; NANO SCALE; NANO-STRUCTURED; OPTICAL COMPONENTS; OUT-OF-PLANE; PROCESS RELIABILITY; REPLICATION TECHNIQUES; SIDEWALL ROUGHNESS; STRUCTURE DESIGN; TOOL LIFE;

EID: 77957852017     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (7)

References (11)
  • 1
    • 0022717983 scopus 로고
    • FABRICATION OF MICROSTRUCTURES WITH HIGH ASPECT RATIOS AND GREAT STRUCTURAL HEIGHTS BY SYNCHROTRON RADIATION LITHOGRAPHY, GALVANOFORMING, AND PLASTIC MOULDING (LIGA PROCESS).
    • DOI 10.1016/0167-9317(86)90004-3
    • Becker, E.W.; Ehrfeld, W.; Hagmann, P.; Maner, A.; Muenchmeyer, D., "Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)", Microelectronic Engineering, 4 (1986) pp. 35-56. (Pubitemid 16587242)
    • (1986) Microelectronic Engineering , vol.4 , Issue.1 , pp. 35-56
    • Becker, E.W.1    Ehrfeld, W.2    Hagmann, P.3    Maner, A.4    Muenchmeyer, D.5
  • 4
    • 0041807953 scopus 로고    scopus 로고
    • Mikroabformung in kunststofi-von der machbarkeitsstudie zur vorserienfertigung
    • Piotter, V.; Hanemann, T.; Heckele, M., "Mikroabformung in KunststofI-von der Machbarkeitsstudie zur Vorserienfertigung". Galvanotechnik, 94 (2003) pp. 1738-1745.
    • (2003) Galvanotechnik , vol.94 , pp. 1738-1745
    • Piotter, V.1    Hanemann, T.2    Heckele, M.3
  • 9
    • 45149111160 scopus 로고    scopus 로고
    • Discrete out-of-plane coupling components for Printed Circuit Board-level optical interconnections
    • Van Erps, J.; Hendrickx, N.; Debaes, c.; Van Daele, P.; Thienpont, H., "Discrete out-of-plane coupling components for Printed Circuit Board-level optical interconnections", IEEE Photonics Technology Letters, Vol. 19 (2007) pp. 1753-1755.
    • (2007) IEEE Photonics Technology Letters , vol.19 , pp. 1753-1755
    • Van Erps, J.1    Hendrickx, N.2    Debaes, C.3    Van Daele, P.4    Thienpont, H.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.