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Volumn 20, Issue 18, 2008, Pages 1539-1541

Hot embossing of microoptical components prototyped by deep proton writing

Author keywords

Coupling components; Deep proton writing (DPW); Hot embossing; Mass fabrication; Plastics; Replication

Indexed keywords

COUPLING COMPONENTS; DEEP PROTON WRITING (DPW); HOT EMBOSSING; MASS FABRICATION; REPLICATION;

EID: 54049099417     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2008.928836     Document Type: Article
Times cited : (38)

References (9)
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  • 2
    • 1642603474 scopus 로고    scopus 로고
    • Review on micro molding of thermoplastic polymers
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  • 3
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    • Microinjection molding of thermoplastic polymers: A review
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    • (2007) J. Micromech. Microeng , vol.17
    • Giboz, J.1    Copponnex, T.2    Mélé, P.3
  • 4
    • 0000670335 scopus 로고    scopus 로고
    • Hot embossing - The molding technique for plastic microstructures
    • M. Heckele, W. Bacher, and K. D. Müller, "Hot embossing - The molding technique for plastic microstructures," Microsyst. Technol. vol. 4, pp. 122-124, 1998.
    • (1998) Microsyst. Technol , vol.4 , pp. 122-124
    • Heckele, M.1    Bacher, W.2    Müller, K.D.3
  • 5
    • 33751059205 scopus 로고    scopus 로고
    • Deep proton writing: A rapid protoyping polymer microfabrication tool for micro-optical modules
    • C. Debaes et al., "Deep proton writing: A rapid protoyping polymer microfabrication tool for micro-optical modules," New J. Phys., vol. 8, pp. 270-288, 2006.
    • (2006) New J. Phys , vol.8 , pp. 270-288
    • Debaes, C.1
  • 6
    • 0022717983 scopus 로고
    • Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)
    • E. W. Becker, W. Erfield, P. Hagmann, A. Maner, and D. Munchmeyer, "Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)," Microelectron. Eng., vol. 4, pp. 35-56, 1986.
    • (1986) Microelectron. Eng , vol.4 , pp. 35-56
    • Becker, E.W.1    Erfield, W.2    Hagmann, P.3    Maner, A.4    Munchmeyer, D.5
  • 7
    • 45149111160 scopus 로고    scopus 로고
    • Discrete out-of-plane coupling components for printed circuit board-level optical interconnections
    • Nov. 1
    • J. Van Erps, N. Hendrickx, C. Debaes, P. Van Daele, and H. Thienpont, "Discrete out-of-plane coupling components for printed circuit board-level optical interconnections," IEEE Photon. Technol. Lett. vol. 19, no. 21, pp. 1753-1755, Nov. 1, 2007.
    • (2007) IEEE Photon. Technol. Lett , vol.19 , Issue.21 , pp. 1753-1755
    • Van Erps, J.1    Hendrickx, N.2    Debaes, C.3    Van Daele, P.4    Thienpont, H.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.