Adhesive bonding of microfluidic chips: Influence of process parameters

Journal of Micromechanics and Microengineering

Volumn 20, Issue 8, 2010, Pages

  Riegger, Lutz ^a   Strohmeier, Oliver ^a   Faltin, Bernd ^a   Zengerle, Roland ^a,b   Koltay, Peter ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b Institute of Micromachining and Information Technology   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE BONDING; ADHESIVE LAYERS; ADHESIVE TRANSFER; CHIP SURFACES; EPOXY ADHESIVES; HIGH TEMPERATURE; MICROFLUIDIC CHIP; POLYMER MICROFLUIDIC CHIPS; POST PROCESSING; PRE-PROCESSING; PROCESS CHAIN; PROCESS PARAMETERS; THIN LAYERS;

FLUIDIC DEVICES; MICROFLUIDICS; SILICONES; STEREO VISION; THIN FILMS;

BONDING;

EID: 77957782124     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/8/087003     Document Type: Article

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