Low temperature adhesion bonding for BioMEMS

Journal of Micromechanics and Microengineering

Volumn 16, Issue 4, 2006, Pages 802-807

  Kentsch, Jörg ^a   Breisch, Stefanie ^a   Stelzle, Martin ^a  

^a UNIVERSITY OF TÜBINGEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FLUIDIC DEVICES; GLASS; POLYMERS; SUBSTRATES;

BIOMEMS; MICRO-FLUIDIC DEVICES; SU-8 STRUCTURES;

ELECTROMECHANICAL DEVICES;

EID: 33645064256     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/4/017     Document Type: Article

References (10)

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