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Journal of Vacuum Science and Technology B

Volumn 28, Issue 4, 2010, Pages 706-714

Atomic diffusion bonding of wafers with thin nanocrystalline metal films

(2) Shimatsu, T a Uomoto, M a

a TOHOKU UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; AMORPHOUS FILMS; CHROMIUM ALLOYS; COPPER ALLOYS; DEPOSITION; ELECTROMECHANICAL DEVICES; GOLD ALLOYS; GRAIN BOUNDARIES; IRON ALLOYS; MEMS; METALLIC FILMS; METALS; PALLADIUM ALLOYS; PLATINUM ALLOYS; QUARTZ; RUTHENIUM ALLOYS; SILICON WAFERS; SILVER ALLOYS; THICK FILMS; THIN FILMS; TITANIUM ALLOYS; WAFER BONDING;

ATOMIC DIFFUSIONS; CRYSTALS STRUCTURES; FILM DEPOSITION; FILM SURFACES; IN-VACUUM; METAL-FILMS; NANOCRYSTALLINES; SELF-DIFFUSION COEFFICIENTS; THIN METAL FILMS; WAFER SURFACE;

BINARY ALLOYS;

EID: 77957229595 PISSN: 21662746 EISSN: 21662754 Source Type: Journal
DOI: 10.1116/1.3437515 Document Type: Conference Paper

Times cited : (126)

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