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Volumn 124, Issue 1, 2010, Pages 371-376
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Copper viscoelasticity manifested in scratch recovery
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Author keywords
Brittleness; Scratch resistance; Thermoelectric materials; Viscoelasticity
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Indexed keywords
INTERGRANULAR SPACE;
LARGE-GRAIN;
MICRO INDENTATION;
ORIENTATION RELAXATION;
SCRATCH RESISTANCE;
SCRATCH TESTING;
SMALL GRAINS;
STORAGE MODULI;
TEMPERATURE RANGE;
THERMAL EXPANSIVITY;
THERMAL MECHANICAL ANALYSIS;
THERMOELECTRIC DEVICES;
THERMOELECTRIC MATERIAL;
VICKERS MICROHARDNESS;
ADHESION;
BRITTLENESS;
DYNAMIC ANALYSIS;
DYNAMIC MECHANICAL ANALYSIS;
ELASTICITY;
FRACTURE MECHANICS;
MAGNETIC THIN FILMS;
OPTICAL MICROSCOPY;
PLASTICITY;
SINTERING;
TENSILE TESTING;
TEXTURES;
THERMOELECTRIC EQUIPMENT;
THERMOELECTRICITY;
THICK FILMS;
VISCOELASTICITY;
VISCOSITY;
MATERIALS;
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EID: 77957226011
PISSN: 02540584
EISSN: None
Source Type: Journal
DOI: 10.1016/j.matchemphys.2010.06.048 Document Type: Article |
Times cited : (11)
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References (39)
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