Effect of microstructure on interphase interaction in layered polycrystalline films of silver-nickel and silver-copper-nickel

Journal of Materials Science

Volumn 35, Issue 3, 2000, Pages 777-781

  Wehr, A ^a   Rylski, A ^b  

^a Connector Lubricant Technology ^*  (United States)

^b LODZ UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; COPPER; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE; NICKEL; POLYCRYSTALLINE MATERIALS; SILVER; SPUTTER DEPOSITION; SURFACE ROUGHNESS;

INTERPHASE BOUNDARY FORMATION; INTERPHASE INTERACTION; POLYCRYSTALLINE FILM;

METALLIC FILMS;

EID: 0034140311     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004725806338     Document Type: Article

References (8)

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