Influence of the recycled glass fibers from nonmetals of waste printed circuit boards on properties and reinforcing mechanism of polypropylene composites

Journal of Applied Polymer Science

Volumn 118, Issue 5, 2010, Pages 2914-2920

  Zheng, Yanhong ^a,b,c   Shen, Zhigang ^c   Ma, Shulin ^c   Cai, Chujiang ^c   Zhao, Xiaohu ^c   Xing, Yushan ^c   Guo, Baohua ^a   Zeng, Xinmiao ^b   Wang, Liancai ^b  

^a TSINGHUA UNIVERSITY   (China)

^b Beijing Radiation Application Research Center   (China)

^c BEIHANG UNIVERSITY   (China)

Author keywords

Composites; Mechanical properties; Poly(propylene) (PP); Recycled glass fibers; Reinforcing mechanism

Indexed keywords

ADDED VALUES; COMPOSITES; FIBER BREAKAGES; HEAT DISTORTION TEMPERATURE; IN-SITU SEM; IN-SITU TENSILE TEST; MECHANICAL AND THERMAL PROPERTIES; POLYPROPYLENE COMPOSITE; RECYCLED GLASS; REINFORCING MECHANISM; SEM; VICAT SOFTENING TEMPERATURE; WASTE PRINTED CIRCUIT BOARD;

FIBERS; GLASS FIBERS; POLYPROPYLENES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PROPYLENE; RECYCLING; REINFORCEMENT; SCANNING ELECTRON MICROSCOPY; TENSILE TESTING; THERMODYNAMIC PROPERTIES; THERMOPLASTICS;

MECHANICAL PROPERTIES;

EID: 77956449846     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.32589     Document Type: Article

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