Influence of nonmetals recycled from waste printed circuit boards on flexural properties and fracture behavior of polypropylene composites

Materials and Design

Volumn 30, Issue 4, 2009, Pages 958-963

  Zheng, Yanhong ^a   Shen, Zhigang ^a   Cai, Chujiang ^a   Ma, Shulin ^a   Xing, Yushan ^a  

^a BEIHANG UNIVERSITY   (China)

Author keywords

Composites (A); Fracture (E); Scanning electron microscopy (G)

Indexed keywords

COMPOSITES (A); EFFECTIVE TESTS; FIBER BREAKAGES; FLEXURAL MODULUS; FLEXURAL PROPERTIES; FLEXURAL STRENGTHS; FLEXURAL TESTS; FRACTURE BEHAVIORS; IN-SITU; MICRO CRACKS; POLYPROPYLENE COMPOSITES; SEM OBSERVATIONS;

BENDING STRENGTH; CHEMICAL ELEMENTS; CRACKS; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; ENERGY DISSIPATION; FRACTURE; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; PUMPING PLANTS; RECYCLING; SCANNING; SCANNING ELECTRON MICROSCOPY; THERMOPLASTICS;

PRINTED CIRCUIT BOARDS;

EID: 57249115920     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2008.07.004     Document Type: Article

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