Thermal conductivity modeling of circular-wire nanocomposites

Journal of Applied Physics

Volumn 108, Issue 4, 2010, Pages

  Hsieh, Tse Yang ^a   Yang, Jaw Yen ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCULAR SHAPE; CIRCULAR WIRES; GEOMETRIC SIMPLIFICATION; GEOMETRY EFFECTS; HOST MATRICES; MULTIBLOCKS; NANO-STRUCTURED; PHONON BOLTZMANN EQUATION; PHONON TRANSPORT; SILICON GERMANIUM; SILICON NANOWIRES; STRUCTURED GRID; THERMAL RESISTANCE; THERMAL TRANSPORT; THERMOELECTRIC DEVICES; WIRE SPACING;

BOLTZMANN EQUATION; GEOMETRY; GERMANIUM; NANOCOMPOSITES; NANOWIRES; PHONONS; THERMAL CONDUCTIVITY; THERMOANALYSIS;

WIRE;

EID: 77956297998     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3457230     Document Type: Conference Paper

References (41)

1. M. S. Dresselhaus, G. Chen, M. Y. Tang, R. G. Yang, H. Lee, D. Wang, Z. Ren, J. P. Fleurial, and P. Gogna, Adv. Mater. ADVMEW 0935-9648 19, 1043 (2007). 10.1002/adma.200600527
2. A. J. Minnich, M. S. Dresselhaus, Z. F. Ren, and G. Chen, Energy Environ. Sci. EESNBY 1754-5692 2, 466 (2009). 10.1039/b822664b
3. M. S. Dresselhaus, G. Chen, Z. F. Ren, G. Dresselhaus, A. Henry, and J. P. Fleurial, JOM JOMMER 1047-4838 61, 86 (2009). 10.1007/s11837-009-0058-y
4. C. Kittel, Introduction to Solid State Physics (Wiley, New York, 1996).
5. C. W. Nan, R. Birringer, D. R. Clarke, and H. Gleiter, J. Appl. Phys. JAPIAU 0021-8979 81, 6692 (1997). 10.1063/1.365209
6. R. G. Yang, G. Chen, and M. S. Dresselhaus, Phys. Rev. B PRBMDO 0163-1829 72, 125418 (2005). 10.1103/PhysRevB.72.125418
7. M. S. Jeng, R. G. Yang, D. Song, and G. Chen, ASME J. Heat Transfer JHTRAO 0022-1481 130, 042410 (2008). 10.1115/1.2818765
8. S. G. Volz and G. Chen, Appl. Phys. Lett. APPLAB 0003-6951 75, 2056 (1999). 10.1063/1.124914
9. T. T. M. Vo, A. J. Williamson, V. Lordi, and G. Galli, Nano Lett. NALEFD 1530-6984 8, 1111 (2008). 10.1021/nl073231d
10. D. Donadio and G. Galli, Phys. Rev. Lett. PRLTAO 0031-9007 102, 195901 (2009). 10.1103/PhysRevLett.102.195901
11. D. G. Cahill, W. K. Ford, K. E. Goodson, G. D. Mahan, A. Majumdar, H. J. Maris, R. Merlin, and S. R. Phillpot, J. Appl. Phys. JAPIAU 0021-8979 93, 793 (2003). 10.1063/1.1524305
12. S. Mazumder and A. Majumdar, ASME J. Heat Transfer JHTRAO 0022-1481 123, 749 (2001). 10.1115/1.1377018
13. A. Majumdar, ASME J. Heat Transfer JHTRAO 0022-1481 115, 7 (1993). 10.1115/1.2910673
14. N. Mingo, L. Yang, D. Li, and A. Majumdar, Nano Lett. NALEFD 1530-6984 3, 1713 (2003). 10.1021/nl034721i
15. S. V. J. Narumanchi, J. Y. Murthy, and C. H. Amon, ASME J. Heat Transfer JHTRAO 0022-1481 126, 946 (2004). 10.1115/1.1833367
16. Y. Chen, D. Li, J. R. Lukes, and A. Majumdar, ASME J. Heat Transfer JHTRAO 0022-1481 127, 1129 (2005). 10.1115/1.2035114
17. P. Hyldgaard and G. D. Mahan, Phys. Rev. B PRBMDO 0163-1829 56, 10754 (1997). 10.1103/PhysRevB.56.10754
18. B. Yang and G. Chen, Phys. Rev. B PRBMDO 0163-1829 67, 195311 (2003). 10.1103/PhysRevB.67.195311
19. G. Chen, Nanosclae Energy Transport and Conversion (Oxford University Press, New York, 2005).
20. G. Chen, ASME J. Heat Transfer JHTRAO 0022-1481 119, 220 (1997). 10.1115/1.2824212
21. G. Chen, Phys. Rev. B PRBMDO 0163-1829 57, 14958 (1998). 10.1103/PhysRevB.57.14958
22. A. Pattamatta and C. K. Madnia, Int. J. Heat Mass Transfer IJHMAK 0017-9310 52, 860 (2009). 10.1016/j.ijheatmasstransfer.2008.09.004
23. R. G. Yang and G. Chen, Phys. Rev. B PRBMDO 0163-1829 69, 195316 (2004). 10.1103/PhysRevB.69.195316
24. R. Prasher, J. Appl. Phys. JAPIAU 0021-8979 100, 064302 (2006). 10.1063/1.2337786
25. T. Y. Hsieh, J. Y. Yang, and Z. C. Hong, J. Appl. Phys. JAPIAU 0021-8979 106, 023528 (2009). 10.1063/1.3182803
26. Q. Hao, G. Chen, and M. S. Jeng, J. Appl. Phys. JAPIAU 0021-8979 106, 114321 (2009). 10.1063/1.3266169
27. D. Song and G. Chen, Appl. Phys. Lett. APPLAB 0003-6951 84, 687 (2004). 10.1063/1.1642753
28. T. Y. Hsieh and J. Y. Yang, " Influence of interface arrangement on phonon heat transfer in nanocomposites.," Jpn. J. Appl. Phys. JJAPA5 0021-4922 (to be published).
29. A. L. Moore, S. K. Saha, R. S. Prasher, and L. Shi, Appl. Phys. Lett. APPLAB 0003-6951 93, 083112 (2008). 10.1063/1.2970044
30. L. C. Liu, M. J. Huang, R. G. Yang, M. S. Jeng, and C. C. Yang, J. Appl. Phys. JAPIAU 0021-8979 105, 104313 (2009). 10.1063/1.3130671
31. A. Sakurai, S. Maruyama, A. Komiya, and K. Miyazaki, Int. J. NanoSci. 7, 103 (2008). 10.1142/S0219581X08005262
32. J. Y. Murthy and S. R. Mathur, ASME J. Heat Transfer JHTRAO 0022-1481 124, 1176 (2002). 10.1115/1.1518495
33. C. Hirsch, Numerical Computation of Internal and External Flows (Wiley, New York, 1988).
34. R. J. Leveque, Finite Volume Methods for Hyperbolic Problems (Cambridge University Press, Cambridge, England, 2002).
35. J. Y. Yang, T. Y. Hsieh, Y. H. Shi, and K. Xu, J. Comput. Phys. JCTPAH 0021-9991 227, 967 (2007). 10.1016/j.jcp.2007.08.014
36. J. M. Ziman, Electrons and Phonons (Oxford University Press, New York, 1985).
37. C. Dames and G. Chen, J. Appl. Phys. JAPIAU 0021-8979 95, 682 (2004). 10.1063/1.1631734
38. J. F. Thompson, Z. U. A. Warsi, and C. W. Mastin, Numerical Grid Generation: Foundations and Applications (Elsevier/North-Holland, New York, NY/Amsterdam, 1985).
39. S. Yoon and A. Jameson, AIAA J. AIAJAH 0001-1452 26, 1025 (1988). 10.2514/3.10007
40. T. -Y. Hsieh, Ph.D. thesis, National Taiwan University, 2007.
41. D. Terris, K. Joulain, D. Lemonnier, and D. Lacroix, J. Appl. Phys. JAPIAU 0021-8979 105, 073516 (2009). 10.1063/1.3086409