Adsorption treatment of oxide chemical mechanical polishing wastewater from a semiconductor manufacturing plant by electrocoagulation

Journal of Hazardous Materials

Volumn 180, Issue 1-3, 2010, Pages 217-224

  Chou, Wei Lung ^a   Wang, Chih Ta ^b   Chang, Wen Chun ^a   Chang, Shih Yu ^a  

^a HUNGKUANG UNIVERSITY   (Taiwan)

^b CHUNG HWA UNIVERSITY OF MEDICAL TECHNOLOGY   (Taiwan)

Author keywords

Adsorption isotherms; Adsorption kinetics; Chemical mechanical polishing (CMP); Electrocoagulation; Thermodynamics; Wastewater treatment

Indexed keywords

ADSORPTION ISOTHERM MODEL; ADSORPTION KINETICS; ADSORPTION STUDIES; BATCH SYSTEMS; CHEMICAL MECHANICAL POLISHING (CMP); ELECTROCOAGULATION; EXPERIMENTAL DATA; EXPERIMENTAL OBSERVATION; FREUNDLICH ADSORPTION ISOTHERMS; METAL HYDROXIDE; OXIDE-CMP; PSEUDO-SECOND-ORDER KINETIC MODELS; SEMICONDUCTOR MANUFACTURING; TEMPERATURE RANGE; THERMODYNAMIC PARAMETER; WASTEWATER QUALITY;

ADSORPTION; ADSORPTION ISOTHERMS; CHEMICAL MECHANICAL POLISHING; CHEMICAL OXYGEN DEMAND; CHEMICALS REMOVAL (WATER TREATMENT); COAGULATION; DYES; EFFLUENTS; KINETIC THEORY; MANUFACTURE; OXYGEN; POLISHING; TEMPERATURE; THERMODYNAMICS; WASTEWATER; WASTEWATER RECLAMATION; WASTEWATER TREATMENT; WATER TREATMENT PLANTS;

CHEMICAL POLISHING;

ADSORPTION; COAGULATION; ELECTROCHEMISTRY; ENTHALPY; ENTROPY; EXPERIMENTAL STUDY; GIBBS FREE ENERGY; ISOTHERM; REACTION KINETICS; SEMICONDUCTOR INDUSTRY; THERMODYNAMICS; WASTEWATER;

ADSORPTION KINETICS; ARTICLE; CHEMICAL OXYGEN DEMAND; EFFLUENT; ELECTROCOAGULATION; ENTHALPY; ENTROPY; SEMICONDUCTOR; TEMPERATURE; THERMODYNAMICS; WASTE WATER; ADSORPTION; CHEMISTRY; ELECTROCHEMISTRY; KINETICS; MATERIALS;

OXIDE; OXYGEN;

ADSORPTION; ELECTROCHEMISTRY; KINETICS; MANUFACTURED MATERIALS; OXIDES; OXYGEN; SEMICONDUCTORS;

EID: 77956206258     PISSN: 03043894     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jhazmat.2010.04.017     Document Type: Article

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