Overview of solid-state thermoelectric refrigerators and possible applications to on-chip thermal management

Proceedings of the IEEE

Volumn 94, Issue 8, 2006, Pages 1602-1611

  Sharp, Jeff ^a   Bierschenk, Jim ^a   Lyon Jr , Hylan B ^b  

^a Marlow Industries Inc   (United States)

^b Gamma Design   (United States)

Author keywords

Chip cooling; Coefficient of performance (COP); Heat sinking; Heat spreading; Solid state cooling; Spot cooling; Thermal management; Thermoelectric; ZT

Indexed keywords

MICROELECTRONICS; MICROPROCESSOR CHIPS; SOLID STATE DEVICES; TEMPERATURE CONTROL; THERMOELECTRICITY;

CHIP COOLING; COEFFICIENT OF PERFORMANCE (COP); HEAT SPREADING; SOLID-STATE COOLING; SPOT COOLING;

REFRIGERATORS;

EID: 33947287148     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2006.879795     Document Type: Review

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