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Volumn 51, Issue 7, 2010, Pages 1183-1187

Influence on the electro-migration resistance by line width and average grain size along the longitudinal direction of very narrow Cu wires

Author keywords

Copper wires; Elect romigration; Electromigration (EM) failure; Median time to failure (MTF); Resistivity

Indexed keywords

AVERAGE GRAIN SIZE; COPPER WIRES; CU WIRES; CURRENT FLOWS; EM RESISTANCE; GRAIN SIZE; LONGITUDINAL DIRECTION; MEDIAN TIME TO FAILURES; RESISTIVITY;

ACTIVATION ENERGY; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; OPTICAL TRANSFER FUNCTION;

WIRE;

EID: 77956165080 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.M2009339 Document Type: Article

Times cited : (8)

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