Effect of thermomechanical treatments on microstructure and properties of Cu-base leadframe alloy

Journal of Materials Science

Volumn 35, Issue 14, 2000, Pages 3641-3646

  Ryu, Ho J ^a   Baik, Hyung K ^b   Hong, Soon H ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COLD ROLLING; CRYSTAL MICROSTRUCTURE; DISLOCATIONS (CRYSTALS); ELECTRIC CONDUCTIVITY OF SOLIDS; GRAIN SIZE AND SHAPE; HOT ROLLING; RECRYSTALLIZATION (METALLURGY); REDUCTION; TENSILE STRENGTH; THERMAL EFFECTS; THERMOMECHANICAL TREATMENT;

DISLOCATION DENSITY; NICKEL SILICIDES;

COPPER ALLOYS;

EID: 0034229190     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004830000742     Document Type: Article

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