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Volumn 46, Issue 7, 2010, Pages 769-774
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Effect of grain size on the grain boundary character distributions of cold rolled and annealed pure copper
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Author keywords
Grain boundary character distribution (GBCD); Grain size; Pure copper; Triple junctions
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Indexed keywords
ELECTRON BACK SCATTER DIFFRACTION TECHNIQUES;
GRAIN BOUNDARY CHARACTER DISTRIBUTIONS;
GRAIN SIZE;
IN-SITU;
INITIAL GRAIN SIZE;
ORIENTATION RELATIONSHIP;
PARAMETER METHODS;
PURE COPPER;
SPECIAL BOUNDARIES;
TRIPLE JUNCTION;
TRIPLE-JUNCTIONS;
ANNEALING;
COLD ROLLING;
COPPER;
GRAIN BOUNDARIES;
METAL CLADDING;
GRAIN SIZE AND SHAPE;
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EID: 77955998500
PISSN: 04121961
EISSN: None
Source Type: Journal
DOI: 10.3724/SP.J.1037.2010.00769 Document Type: Article |
Times cited : (15)
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References (24)
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