|
|
Volumn 16, Issue 7, 2010, Pages 1051-1055
|
|
3D System-on-Chip technologies for More than Moore systems
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
3-D INTEGRATION;
3D PACKAGING;
3D SYSTEMS;
AUTOMOTIVE APPLICATIONS;
BACK END OF LINES;
COST DOWNS;
COST-EFFECTIVE FABRICATION;
FABRICATED DEVICE;
FABRICATION COST;
HETEROGENEOUS SYSTEMS;
ICV-SLID;
INTERCONNECT PERFORMANCE;
KEY SOLUTION;
PREDICTED PERFORMANCE;
TECHNOLOGY CHOICES;
THERMO-MECHANICAL STRESS;
THROUGH-SILICON-VIA;
TIRE-PRESSURE MONITORING SYSTEMS;
ULTRA-SMALL;
APPLICATION SPECIFIC INTEGRATED CIRCUITS;
CHIP SCALE PACKAGES;
FABRICATION;
PROGRAMMABLE LOGIC CONTROLLERS;
STRESSES;
TECHNOLOGY;
THREE DIMENSIONAL;
|
|
EID: 77955850917
PISSN: 09467076
EISSN: None
Source Type: Journal
DOI: 10.1007/s00542-009-0976-1 Document Type: Conference Paper |
|
Times cited : (54)
|
|
References (7)
|
