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Volumn 16, Issue 5, 2010, Pages 728-733

Microencapsulation of imidazole curing agent for epoxy resin

Author keywords

Curing agent; Epoxy resin; Imidazole; Microencapsulation

Indexed keywords

CONDUCTING FILMS; CURING AGENTS; CURING BEHAVIOR; CURING REACTIONS; CURING SYSTEM; EPOXY RESIN SYSTEM; IMIDAZOLE; KINETIC BEHAVIOR; MICROCAPSULE FORMATION; MICROCAPSULES; MICROENCAPSULATION; PHENYLIMIDAZOLE; SHELF LIFE; SOLVENT EVAPORATION METHOD; WALL MATERIALS;

EID: 77955845108     PISSN: 1226086X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jiec.2010.07.011     Document Type: Article
Times cited : (84)

References (22)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.