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Volumn 16, Issue 5, 2010, Pages 728-733
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Microencapsulation of imidazole curing agent for epoxy resin
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Author keywords
Curing agent; Epoxy resin; Imidazole; Microencapsulation
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Indexed keywords
CONDUCTING FILMS;
CURING AGENTS;
CURING BEHAVIOR;
CURING REACTIONS;
CURING SYSTEM;
EPOXY RESIN SYSTEM;
IMIDAZOLE;
KINETIC BEHAVIOR;
MICROCAPSULE FORMATION;
MICROCAPSULES;
MICROENCAPSULATION;
PHENYLIMIDAZOLE;
SHELF LIFE;
SOLVENT EVAPORATION METHOD;
WALL MATERIALS;
CURING;
ENCAPSULATION;
ETHANOL;
PACKAGING;
POLYCAPROLACTONE;
SYNTHETIC RESINS;
EPOXY RESINS;
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EID: 77955845108
PISSN: 1226086X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jiec.2010.07.011 Document Type: Article |
Times cited : (84)
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References (22)
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