Effect of microencapsulated curing agents on the curing behavior for diglycidyl ether of bisphenol a epoxy resin systems

Journal of Applied Polymer Science

Volumn 107, Issue 3, 2008, Pages 1661-1669

  Xu, Hongxia ^a   Fang, Zhengping ^a   Tong, Lifang ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Curing of polymers; Kinetics (polym.); Microencapsulation

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; EMULSION POLYMERIZATION; EPOXY RESINS; PARTICLE SIZE; REACTION KINETICS; THERMAL EFFECTS;

BISPHENOL; MICROENCAPSULATED CURING AGENTS; POLYMERIC WALL;

ETHERS;

CURING (CHEMISTRY); EMULSION; EPOXY RESIN; GLASS TRANSITION TEMPERATURE; MICROENCAPSULATION; PARTICLE SIZE; POLYMERIZATION; POLYMETHYL METHACRYLATE; SOLVENT;

EID: 38149109148     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.26972     Document Type: Article

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