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Scripta Materialia

Volumn 63, Issue 4, 2010, Pages 430-433

The shape of bubbles in He-implanted Cu and Au

(4) Wei, Qiangmin a Li, Nan b Sun, Kai a Wang, L M a

a UNIVERSITY OF MICHIGAN (United States)

b Department of Electrical and Computer Engineering (United States)

Author keywords

Annealing; Copper; Implantation; Transmission electron microscopy (TEM)

Indexed keywords

BUBBLE MOBILITY; IMPLANTATION; IN-SITU TRANSMISSION; MINIMUM ENERGY; NON-SPHERICAL; THERMAL-ANNEALING; TRANSMISSION ELECTRON; WULFF CONSTRUCTION;

ANNEALING; EDGE DISLOCATIONS; IN SITU PROCESSING; OSTWALD RIPENING; SINGLE CRYSTALS;

TRANSMISSION ELECTRON MICROSCOPY;

EID: 77955665132 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2010.04.043 Document Type: Article

Times cited : (49)

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