Dielectric properties and partial discharge endurance of polypropylene-silica nanocomposite

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 17, Issue 4, 2010, Pages 1259-1267

  Takala, M ^a   Ranta, H ^a   Nevalainen, P ^a   Pakonen, P ^a   Pelto, J ^b   Karttunen, M ^b   Virtanen, S ^c   Koivu, V ^c   Pettersson, M ^c   Sonerud, B ^d   Kannus, K ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

^c UNIVERSITY OF JYVÄSKYLÄ   (Finland)

^d CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Dielectric properties; nanocomposite; partial discharge; polypropylene; silica

Indexed keywords

AC VOLTAGE; BREAKDOWN STRENGTHS; DIELECTRIC MEASUREMENTS; DIELECTRIC RESPONSE; HIGH VOLTAGE APPLICATIONS; LOSS FACTOR; MATERIAL SURFACE; MICRO RAMAN SPECTROSCOPY; ORIENTED THIN FILMS; POWER CAPACITOR; SILICA NANOCOMPOSITES; TEM; X-RAY TOMOGRAPHY;

CAPACITANCE; DC POWER TRANSMISSION; DIELECTRIC PROPERTIES; DURABILITY; NANOCOMPOSITES; OPTICAL MICROSCOPY; POLYPROPYLENES; RAMAN SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SILICA; THERMOPLASTICS; TOMOGRAPHY; TRANSMISSION ELECTRON MICROSCOPY;

PARTIAL DISCHARGES;

EID: 77955564053     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDEI.2010.5539698     Document Type: Article

References (42)

1. J. K. Nelson, Y. Hu and J. Thiticharoenpong, "Electrical Properties of TiO2 Nanocomposites", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), pp. 719-722, 2003.
2. S. Rätzke and J. Kindersberger, "Erosion Behaviour of Nano Filled Silicone Elastomers", XIVth Intern. Sympos. High Voltage Eng. (ISH), pp. 1-6, 2005.
3. T. J. Lewis, "Interfaces are the Dominant Feature of Dielectrics at the Nanometric Level", IEEE Trans. Dielectr. Electr. Insul., Vol.11, pp. 739-753, 2004.
4. M. F. Frechette, M. Trudeau, H. D. Alamdari and S. Boily, "Introductory Remarks on Nanodielectrics", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), pp. 92-99, 2001.
5. G. C. Montanari, D. Fabiani, F. Palmieri, D. Kaempfer, R. Thomann and R. Mülhaupt, "Modification of Electrical Properties and Performance of EVA and PP Insulation through Nanostructure by Organophilic Silicates", IEEE Trans. Dielectr. Electr. Insul., Vol.11, pp. 754-762, 2004.
6. J. K. Nelson and Y. Hu, "Nanocomposite Dielectrics-Properties and Implications", J. Phys. D: Appl. Phys., Vol.38, pp. 213-222, 2005.
7. T. J. Lewis, "Nanometric Dielectrics", IEEE Trans. Dielectr. Electr. Insul., Vol.1, pp. 812-825, 1994.
8. S. Pothukuchi, Y. Li and C. P. Wong, "Shape Controlled Synthesis of Nanoparticles and Their Incorporation into Polymers", Electronic Components and Technology Conf., pp. 1965-1967, 2004.
9. J. K. Nelson and J. C. Fothergill, "Internal Charge Behaviour of Nanocomposites", Nanotechnology, Vol.15, pp. 586-595, 2004.
10. T. Tanaka, G. C. Montanari and R. Mülhaupt, "Polymer Nanocomposites as Dielectrics and Electrical Insulation- perspectives for Processing Technologies, Material Characterization and Future Applications", IEEE Trans. Dielectr. Electr. Insul., Vol.11, pp. 763-784, 2004.
11. T. Tanaka, M. Kozako, N. Fuse and Y. Ohki, "Proposal of a Multicore Model for Polymer Nanocomposite Dielectrics", IEEE Trans. Dielectr. Electr. Insul., Vol.12, pp. 669-681, 2005.
12. J. K. Nelson, J. C. Fothergill, L. A. Dissado and W. Peasgood, "Towards an Understanding of Nanometric Dielectrics", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), pp. 295-298, 2002.
13. A. L. An and S. A. Boggs, "What is "Nano" in the Context of a Filled Dielectric", Conf. Record of the 2006 IEEE Intern. Sympos. Electr. Insul., pp. 273-276, 2006.
14. T. Tanaka, "Dielectric Nanocomposites with Insulating Properties", IEEE Trans. Dielectr. Electr. Insul., Vol.12, No.5, pp. 914-928, 2005.
15. M. Roy, J. K. Nelson, R. K. MacCrone, L. S. Schandler, C. W. Reed, R. Keefe and W. Zenger, "Polymer Nanocomposite Dielectrics: The Role of the Interface", IEEE Trans. Dielectr. Electr. Insul., Vol.12, No.4, pp. 629-643, 2005.
16. M. F. Frechette and C. W. Reed, "The Emerging Field of Nanodielectrics: an Annotated Appreciation", IEEE Intern. Sympos. Electr. Insul., pp. 458-465, 2006.
17. T. Tanaka and M. Frechette, "Emerging Nanocomposite Dielectrics", CIGRE Task Force Report, ELECTRA, No.226, pp. 24-32, 2006.
18. K. Jiang, L. Cheng, L. Zheng, Z. Yao, G. Li and Q. Yin, "The Unique Dielectric Behaviour of Nanosilica Epoxy Composites", 7th IEEE Intern. Conf. Nanotechnology, pp. 1101-1106, 2007.
19. T. Imai, G. Komiya, K. Murayama, T. Ozaki, F. Sawa, T. Shimizu, M. Harada, M. Ochi, Y. Ohki and T. Tanaka, "Improving Epoxy-based Insulating Materials with Nano-fillers toward Practical Application", IEEE Intern. Sympos. Electr. Insul., pp. 201-204, 2008.
20. T. Tanaka, Y. Ohki, M. Ochi, M. Harada and T. Imai, "Enhanced Partial Discharge Resistance of Epoxy/Clay Nanocomposite Prepared by Newly Developed Organic Modification and Solubilization Methods", IEEE Trans. Dielectr. Electr. Insul., Vol.15, pp. 81-89, 2005.
21. T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako and T. Tanaka, "Effects of Nano- and Micro-filler Mixture on Electrical Insulation Properties of Epoxy Based Composites", IEEE Trans. Dielectr. Electr. Insul., Vol.13, pp. 319-326, 2006.
22. T. Iizuka, K. Uchida and T. Tanaka, "Different Voltage Endurance Characteristics of Epoxy/silica Nanocomposites Prepared by Two Kinds of Dispersion Methods", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), pp. 236-239, 2007.
23. T. Tanaka, Y. Matsuo and K. Uchida, "Partial Discharge Endurance of Epoxy/SiC Nanocomposite", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), pp. 13-16, 2008.
24. T. Iizuka, Y. Ohki and T. Tanaka, "Effects of Coupling Agents and Filler Dispersion on V-t Characteristics of Epoxy/Silica Nanocomposites", Intern. Sympos. Electr. Insulating Materials, pp. 60-63, 2008.
25. I. Ramirez, E. A. Cherney, S. Jayaram and M. Gauthier, "Silicone Rubber Nanocomposites for Outdoor Insulation Applications", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), pp. 384-387, 2007.
26. I. Ramirez, S. Jayaram, E. A. Cherney, M. Gauthier and L. Simon, "Erosion Resistance and Mechanical Properties of Silicone Nanocomposite Insulation", IEEE Trans. Dielectr. Electr. Insul., Vol.16, pp. 52-59, 2009.
27. N. A. Perez, A. Sylvestre, J. L. Auge, M. T. Do and S. Rowe, "Dielectric Spectroscopy in Silicone Rubber Incorporating Nanofillers", IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), pp. 453-456, 2006.
28. A. H. El-Hag, L. C. Simon, S. H. Jayaram and E. A. Cherney, "Erosion Resistance of Nano-filled Silicone Rubber", IEEE Trans. Dielectr. Electr. Insul., Vol.13, pp. 122-128, 2006.
29. M. Zhang, S. Zeng, T. Dong, Y. Fan and Q. Lei, "Study on the Dielectric Properties of Polyimide/Silica Nanocomposite Films", IEEE 8th Intern. Conf. Properties and Applications of Dielectric Materials (ICPADM), pp. 733 - 735, 2006.
30. F. Guastavino, E. Torello, A. Dardano, S. Bono, M. Pellegrini and L. Vignati, "A Comparison of the Short and Long Term Behaviour of Nanostructured Enamels with the Performances of Conventional Insulation", IEEE Intern. Sympos. Electr. Insul., pp. 659-662, 2008.
31. B. Chen, J. Du and C. Hou, "The Effects of Chemical Structure on the Dielectric Properties of Polyetherimide and Nanocomposites" IEEE Trans. Dielectr. Electr. Insul., Vol.15, pp. 127-133, 2008.
32. C. Zou, J. C. Fothergill, M. Fu and J. K. Nelson, "Improving the Dielectric Properties of Polymers by Incorporating Nanoparticles", 10th Intern. Conf. Electr. Insul., INSUCON, Birmingam, UK, pp. 125-130, 2006.
33. M. Takala, M. Karttunen, P. Salovaara, S. Kortet, K. Kannus and T. Kalliohaka, "Dielectric Properties of Nanostructured Polypropylene- Polyhedral Oligomeric Silsesquioxane Compounds", IEEE Trans. Dielectr. Electr. Insul., Vol.15, pp. 40-51, 2008.
34. M. Takala, H. Ranta, J. Pelto, S. Virtanen, V. Koivu, M. Pettersson, K. Kannus, "Dielectric Properties of Polypropylene-Silica Nanocomposites" , 21st Nordic Insulation Symposium, NORD-IS09, Gothenburg, Sweden, pp. 31-35, 2009.
35. IEC Publication 60243-1: "Electrical Strength of Insulating Materials-Test Methods-Part 1: Test at Power Frequencies", 1998.
36. B. Sonerud, T. Bengtsson, J. Blennow, and S. M. Gubanski, "Dielectric response measurements utilizing semi-square voltage waveforms", IEEE Trans. Dielectr. Electr. Insul., Vol.15, pp. 920-926, 2008.
37. B. Sonerud, T. Bengtsson, J. Blennow, and S. M. Gubanski, "High voltages with high harmonic content: The influence on dielectric heating" in Proceedings of the 16th International Symposium of High Voltage Engineering (ISH 09), Cape Town, South Africa, Paper ID F5, 2009.
38. IEC 60270: "High-Voltage Test Techniques - Partial Discharge Measurements", 2000.
39. IEEE Standard 930: "IEEE Guide for the Statistical Analysis of Electrical Insulation Breakdown Data", IEEE Dielectr. Electr. Insul. Society, 2005.
40. W. Hauschild and W. Mosch, Statistical Techniques for High-Voltage Engineering, Peter Peregrinus Ltd., London, UK, 1992.
41. P. K. Bun and S. P. Kang, "Temperature Coefficient and Capacitance Retrace of Polypropylene Film Capacitors", IEEE Trans. Electr. Insul., Vol.9, pp. 5-11, 1974.
42. M. G. Danikas and T. Tanaka, "Nanocomposites-A Review of Electrical Treeing and Breakdown", IEEE Electr. Insul. Mag., Vol.25, pp. 19-25, 2009.