-
1
-
-
0024698921
-
Toughening Mechanisms in Elastomer-Modified Epoxies. III. The Effect of Cross-Link Density
-
R. A. Pearson and A. F. Yee, "Toughening Mechanisms in Elastomer-Modified Epoxies. III. The Effect of Cross-Link Density", J. Mater. Sci., Vol. 24, pp. 2571-2580, 1989.
-
(1989)
J. Mater. Sci
, vol.24
, pp. 2571-2580
-
-
Pearson, R.A.1
Yee, A.F.2
-
2
-
-
0032672482
-
Effects of Particle Shape, Size and Interfacial Adhesion on the Fracture Strength of Silica-Filled Epoxy Resin
-
Y. Nakamura, S. Okabe, and T. Iida, "Effects of Particle Shape, Size and Interfacial Adhesion on the Fracture Strength of Silica-Filled Epoxy Resin", Polym. Polym. Compos., Vol. 7, pp. 177-186, 1999.
-
(1999)
Polym. Polym. Compos
, vol.7
, pp. 177-186
-
-
Nakamura, Y.1
Okabe, S.2
Iida, T.3
-
3
-
-
0027264228
-
The Effect of Silica Surface Modification on the Dielectric Properties of Silica-Filled Epoxy Compounds
-
P. Myslinski, and Z. Lazowski, "The Effect of Silica Surface Modification on the Dielectric Properties of Silica-Filled Epoxy Compounds", Mater. Chem. Phys., Vol. 33, pp. 139-144, 1993.
-
(1993)
Mater. Chem. Phys
, vol.33
, pp. 139-144
-
-
Myslinski, P.1
Lazowski, Z.2
-
4
-
-
0035244851
-
Dielectric Properties of Epoxy/Silica Composites used for Microlectronic Packaging, and their Dependence on Post-Curing
-
P. Gonon, and A. Sylvestre, "Dielectric Properties of Epoxy/Silica Composites used for Microlectronic Packaging, and their Dependence on Post-Curing", J. Mater. Sci: - Mater. Electron., Vol. 12, pp. 81-86, 2001.
-
(2001)
J. Mater. Sci: - Mater. Electron
, vol.12
, pp. 81-86
-
-
Gonon, P.1
Sylvestre, A.2
-
5
-
-
0035927989
-
Combined Effects of Humidity and Thermal Stress on the Dielectric Properties of Epoxy-Silica Composites
-
P. Gonon, A. Sylvestre, J. Teysseyre, and C. Prior, "Combined Effects of Humidity and Thermal Stress on the Dielectric Properties of Epoxy-Silica Composites", Mater. Sci. Eng. B, Vol. 83, pp. 158-164, 2001.
-
(2001)
Mater. Sci. Eng. B
, vol.83
, pp. 158-164
-
-
Gonon, P.1
Sylvestre, A.2
Teysseyre, J.3
Prior, C.4
-
6
-
-
33847256465
-
Post-curing Influence on Electrostatic Charges Deposited on Epoxy/Silica Composites used for Microelectronic Packaging
-
and 2, pp
-
th EPTC, Vol. 1 and 2, pp. 744-748, 2005.
-
(2005)
th EPTC
, vol.1
, pp. 744-748
-
-
Sylvestre, A.1
Ouajji, H.2
Gonon, P.3
Teysseyre, J.4
Jomni, F.5
Raouadi, K.6
-
8
-
-
0142258097
-
Molecular Basis of the Interphase Dielectric Properties of Microelectronic and Optoelectronic Packaging Materials
-
M. G. Todd and F. G. Shi, "Molecular Basis of the Interphase Dielectric Properties of Microelectronic and Optoelectronic Packaging Materials", IEEE Trans. Comp. Pack. Tech., Vol. 26, pp. 667-672, 2003.
-
(2003)
IEEE Trans. Comp. Pack. Tech
, vol.26
, pp. 667-672
-
-
Todd, M.G.1
Shi, F.G.2
-
10
-
-
9144248614
-
Interfaces are the Dominant Feature of Dielectrics at the Nanometeric Level
-
T. J. Lewis, "Interfaces are the Dominant Feature of Dielectrics at the Nanometeric Level", IEEE Trans. Dielectr. Electr. Insul., Vol. 11, No. 5, pp. 739-753, 2004.
-
(2004)
IEEE Trans. Dielectr. Electr. Insul
, vol.11
, Issue.5
, pp. 739-753
-
-
Lewis, T.J.1
-
11
-
-
12844277323
-
Interfaces: Nanometric Dielectrics
-
T. J. Lewis, "Interfaces: Nanometric Dielectrics", J. Phys. D: Appl. Phys., Vol.38, pp. 202-212, 2005.
-
(2005)
J. Phys. D: Appl. Phys
, vol.38
, pp. 202-212
-
-
Lewis, T.J.1
-
12
-
-
27744530931
-
Polymer Nanocomposite Dielectrics-the Role of the Interface
-
M. Roy, J. K. Nelson, R. K. MacCrone, L. S. Schadler, C. W. Reed, R. Keefe and W. Zenger, "Polymer Nanocomposite Dielectrics-the Role of the Interface", IEEE Trans. Dielectr. Electr. Insul., Vol. 12, pp. 629-43, 2005.
-
(2005)
IEEE Trans. Dielectr. Electr. Insul
, vol.12
, pp. 629-643
-
-
Roy, M.1
Nelson, J.K.2
MacCrone, R.K.3
Schadler, L.S.4
Reed, C.W.5
Keefe, R.6
Zenger, W.7
-
13
-
-
17744374776
-
Role of the Interface in Determining the Dielectric Properties of Nanocomposites
-
J. K. Nelson, L. A. Utracki, R. K. MacCrone and C. W. Reed, "Role of the Interface in Determining the Dielectric Properties of Nanocomposites", IEEE-CEIDP, pp. 314-17, 2004.
-
(2004)
IEEE-CEIDP
, pp. 314-317
-
-
Nelson, J.K.1
Utracki, L.A.2
MacCrone, R.K.3
Reed, C.W.4
-
14
-
-
9144222213
-
Polymer Nanocomposites as Dielectrics and Electrical Insulation-perspectives for Processing Technologies, Material Characterization and Future Applications
-
T. Tanaka, G. C. Montanari and R. Mülhaupt, "Polymer Nanocomposites as Dielectrics and Electrical Insulation-perspectives for Processing Technologies, Material Characterization and Future Applications", IEEE Trans. Dielectr. Electr. Insul., Vol. 11, pp. 763-784, 2004.
-
(2004)
IEEE Trans. Dielectr. Electr. Insul
, vol.11
, pp. 763-784
-
-
Tanaka, T.1
Montanari, G.C.2
Mülhaupt, R.3
-
15
-
-
0037011801
-
Preparation and Properties of Nano-Al2O3 Particles/Polyester/Epoxy Resin Ternary Composites
-
Y. M. Cao, J. Sun and D. H. Yu, "Preparation and Properties of Nano-Al2O3 Particles/Polyester/Epoxy Resin Ternary Composites", J.Appl. Polym. Sci., Vol. 83, pp. 70-77, 2002.
-
(2002)
J.Appl. Polym. Sci
, vol.83
, pp. 70-77
-
-
Cao, Y.M.1
Sun, J.2
Yu, D.H.3
-
16
-
-
0346361527
-
The Glass Transition of Polymer - Single Walled Carbon Nanotube Composite Films
-
J. Q. Pham, C. A. Mitchell, J. L. Bahr, J. M. Tour, R. Krishnamoorti and P. F. Green, "The Glass Transition of Polymer - Single Walled Carbon Nanotube Composite Films", J. Polym. Sci., Part B: Polym. Phys., Vol. 41, pp. 3339-3345, 2003.
-
(2003)
J. Polym. Sci., Part B: Polym. Phys
, vol.41
, pp. 3339-3345
-
-
Pham, J.Q.1
Mitchell, C.A.2
Bahr, J.L.3
Tour, J.M.4
Krishnamoorti, R.5
Green, P.F.6
-
17
-
-
14644431021
-
Influence of Interphase and Moisture on the Dielectri Spectroscopy of Epoxy/Silica Composites
-
Y. Y. Sun, Z. Q. Zhang and C. P. Wong, "Influence of Interphase and Moisture on the Dielectri Spectroscopy of Epoxy/Silica Composites", Polym. Vol.46, pp. 2297-2305, 2005.
-
(2005)
Polym
, vol.46
, pp. 2297-2305
-
-
Sun, Y.Y.1
Zhang, Z.Q.2
Wong, C.P.3
-
19
-
-
2642569293
-
Internal Charge Behaviour of Nanocomposites
-
J. K. Nelson and J. C. Fothergill, "Internal Charge Behaviour of Nanocomposites", Nanotechnology, Vol. 15, pp. 586-595, 2004.
-
(2004)
Nanotechnology
, vol.15
, pp. 586-595
-
-
Nelson, J.K.1
Fothergill, J.C.2
-
20
-
-
0000322114
-
Influence of the glass transition on the secondary relaxation of an epoxy resin
-
R. Casalini, D. Fioretto, A. Livi, M. Lucchesi, and P. A. Rolla, "Influence of the glass transition on the secondary relaxation of an epoxy resin", Physical Review B, 56, 6, pp.3016-3021,1997
-
(1997)
Physical Review B
, vol.56
, Issue.6
, pp. 3016-3021
-
-
Casalini, R.1
Fioretto, D.2
Livi, A.3
Lucchesi, M.4
Rolla, P.A.5
-
21
-
-
0003962895
-
Engineered Materials Handbook
-
ASM International, Materials Park
-
S. J. Schneider, J. R. Davis, G. M. Davidson, S. R. Lampman, M. S. Woods and T. B. Zorc, "Engineered Materials Handbook", Vol. 4: Ceramics and Glasses, ASM International, Materials Park, 1991.
-
(1991)
Ceramics and Glasses
, vol.4
-
-
Schneider, S.J.1
Davis, J.R.2
Davidson, G.M.3
Lampman, S.R.4
Woods, M.S.5
Zorc, T.B.6
-
22
-
-
33646519704
-
Ferroelectric Relaxor Behavior in Hafnium Doped Barium-Titanate Ceramic
-
S. Anwar, P. R. Sagdeo and N. P. Lalla, "Ferroelectric Relaxor Behavior in Hafnium Doped Barium-Titanate Ceramic", Solid State Commun, Vol. 138, pp. 331-336, 2006.
-
(2006)
Solid State Commun
, vol.138
, pp. 331-336
-
-
Anwar, S.1
Sagdeo, P.R.2
Lalla, N.P.3
-
23
-
-
33845727533
-
3 Near Room Temperature
-
3 Near Room Temperature", Appl. Phys. Lett. Vol. 89, pp. 42912-42912, 2006.
-
(2006)
Appl. Phys. Lett
, vol.89
, pp. 42912-42912
-
-
Mischenko, A.S.1
Zhang, Q.2
Whatmore, R.W.3
Scott, J.F.4
Mathur, N.D.5
-
24
-
-
0032050290
-
Electric Modulus and Interfacial Ppolarization in Composite Polymeric Systems
-
G. M. Tsangaris, G. C. Psarras, N. Kouloumbi, "Electric Modulus and Interfacial Ppolarization in Composite Polymeric Systems", J. Mater. Sci, Vol. 33, pp. 2027-2037, 1998.
-
(1998)
J. Mater. Sci
, vol.33
, pp. 2027-2037
-
-
Tsangaris, G.M.1
Psarras, G.C.2
Kouloumbi, N.3
|