Effect of coupling agent on the thermal and dielectric properties of PTFE/Sm2Si2O7 composites

Composites Part A: Applied Science and Manufacturing

Volumn 41, Issue 9, 2010, Pages 1148-1155

  Thomas, Sherin ^a   Raman, Sujith ^b   Mohanan, P ^b   Sebastian, M T ^a  

^a REGIONAL RESEARCH LABORATORY CSIR   (India)

^b Department of Polymer Science and Rubber Technology   (India)

Author keywords

A. Polymer matrix composites (PMCs); B. Electrical properties; E. Powder processing

Indexed keywords

CHEMICALLY MODIFIED; EFFECTIVE MEDIUM THEORIES; ELECTRICAL PROPERTY; EXPERIMENTAL VALUES; FILLER CONTENTS; FILLER SURFACES; LOW DIELECTRIC LOSS; MATRIX; MICRO-STRUCTURAL; POWDER PROCESSING; POWDER PROCESSING TECHNIQUES; RELATIVE PERMITTIVITY; SEM; SILANE COUPLING AGENT; SURFACE MODIFICATION; THEORETICAL PREDICTION; THERMAL PROPERTIES; WELL-DISPERSED;

COUPLING AGENTS; DIELECTRIC LOSSES; ELECTRIC PROPERTIES; FILLERS; HOT PRESSING; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; SILANES; SILICON; THERMODYNAMIC PROPERTIES;

POLYMER MATRIX COMPOSITES;

EID: 77955414417     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2010.04.013     Document Type: Conference Paper

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