A flat heat pipe architecture based on nanostructured titania

Journal of Microelectromechanical Systems

Volumn 19, Issue 4, 2010, Pages 878-884

  Ding, Changsong ^a   Soni, Gaurav ^b   Bozorgi, Payam ^b   Piorek, Brian D ^c,d   Meinhart, Carl D ^b   MacDonald, Noel C ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b University of California   (United States)

^c SpectraFluidics Inc   (United States)

^d Gas Reaction Technologies Inc   (United States)

Author keywords

Heat pipe; nanostructure; Thermal Ground Plane (TGP); titanium; vapor chamber

Indexed keywords

CAVITY VOLUME; EFFECTIVE THERMAL CONDUCTIVITY; FLAT HEAT PIPE; FLUID TRANSPORT; GROUND PLANES; HERMITICITY; HIGH ASPECT RATIO; IMPROVING SYSTEMS; LASER WELDING; MICROFABRICATED; NANOSTRUCTURED TITANIA; PACKAGING TECHNIQUES; PLANAR HEAT SOURCE; PROCESSING TECHNIQUE; SUPER-HYDROPHILIC; THERMAL CONTACT RESISTANCE; THERMAL GROUND PLANE (TGP); TITANIUM SUBSTRATES; VAPOR CHAMBER; WATER LOSS; WICKING; WICKING STRUCTURE; WORKING FLUID;

ASPECT RATIO; CHIP SCALE PACKAGES; HEAT PIPES; HYDROPHILICITY; MICROFABRICATION; MICROPROCESSOR CHIPS; NANOSTRUCTURES; PLANTS (BOTANY); SUBSTRATES; THERMAL CONDUCTIVITY; TITANIUM; TITANIUM DIOXIDE; VAPORS;

HEAT RESISTANCE;

EID: 77955383450     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2051019     Document Type: Article

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